Physical design and technology parameters for vertical system-in-package integration

Abstract

The physical design for vertical integration is considered to be a relatively new research field. The novel approach of physical design structure, design oriented classification of vertical SiP technologies and key parameters for technology selection are presented in this pape

Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies

“…Folded modules show a reduced wiring density at a bending radius below 100µm because the allowed thickness limits the number of possible metal layers, whereas module stacks with inside interconnection like solder balls permit higher wiring capacities at very thin component layers. The corresponding formulas can be found in [19]. Module stacks with sidewall interconnection allow a relatively independent design of the several modules and provide a wiring density which is not influenced by the thickness of the vertical layers.…”

Integration technology parameters for physical design of vertical system-in-package

“…are defined for the most part. After partitioning and placement before starting a fine routing, the designer of 2D systems like PCB/MCM compares different interconnection and substrate technologies by clearly defined parameters [18], which are partly presented in Tables 1 and 2, and formulates the design rules in accordance with them. Within the 2.5D integration, where the functional layers are vertically integrated on each other [5], the physical design could be subdivided into two stages:…”

“…In [18], 2.5D SiP-Solutions have been subdivided in four groups, in accordance with their capability to connect/redistribute signals and nets in the vertical or lateral wiring passage (Fig.3 [12,13] Parameter's Set Considering the net complexity schema and being supported by essential parameters which are partly presented in Table 3, a SiP designer at the beginning of the detailed layout/implementation stage can choose between four technology groups and start optimizing results of global layout targeting the chosen technology.…”