Physical mechanisms governing pattern fidelity in microscale offset printing

Darhuber, Anton A.; Troian, Sandra M.; Wagner, S.

doi:10.1063/1.1389080

Cited by 55 publications

(56 citation statements)

References 20 publications

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“…High-resolution wet printing was studied by using dip-coating surfaces selectively patterned with regions of different surface tension [24,25]. A liquid-metal micromotor was described [26], which was driven by surface tension.…”

Section: Application To Self-alignmentmentioning

confidence: 99%

Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self‐Assembly of Microdevices

et al. 2003

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The parallel fluidic self-assembly of microdevices is a new technology that promises to speed up the production of complex microsystems made up of many separate parts. The technology brings many advantages. First, it enables a mix of chipmaking technologies for each of the component parts, with each technology selected for its particular technical or financial benefits. Second, it eliminates the need for pickand-place assembly that would unnecessarily slow down any manual assembly technique. Third, it enables massively parallel assembly, almost independent of the number of parts involved, and thereby mimics the elegant parallelism inherent in microchip circuit manufacture.In this chapter we explore this new technology with the ultimate goal of discovering the practical limits for its practical use in manufacturing real microsystems. The driving force of the assembly process is interface surface tension, and our approach is to find the simplest models that correctly describe the attachment, orientation, and bonding of parts to a suitably prepared substrate. We follow both an analytical and a numerical approach in describing the surface tension effects, the latter mainly to gain geometrical generality, and we couple modeling and simulation with suitable laboratory experiments. The ultimate goal of this work is to find practical design rules with which to select bond site geometries and the properties of participating liquids, and to find practical tolerances for all required geometrical and rheological parameters. This chapter extensively documents all results found to date, and carefully cites other work in this area.

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Section: Application To Self-alignmentmentioning

confidence: 99%

Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self‐Assembly of Microdevices

et al. 2003

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“…One approach is to use a prepolymer ink that can be cured during or immediately after printing. 18 A second approach is to use a thermoplastic polymer, which can be heated to a temperature above T g during inking and transfer but then rapidly cooled to fix the pattern and prevent undesirable spreading.…”

Section: A Materials Selection and Preparationmentioning

confidence: 99%

Direct printing of polymer microstructures on flat and spherical surfaces using a letterpress technique

Miller

Troian

Wagner

2002

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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We have developed a letterpress technique capable of printing polymer films with micrometer scale feature sizes onto flat or spherically shaped nonporous substrates. This printing technique deposits polymer only in desired regions thereby eliminating subsequent developing and subtraction steps. Flat or curved printing plates, which are fabricated from either rigid or deformable materials, are used to transfer thin molten polymer films onto flat target substrates. By deforming the printing plates into a spherical shape, it is also possible to print patterned films onto the concave side of a spherically deformed target substrate. These printed films serve as good resists for both wet chemical etching and reactive ion etching. Interferometric measurements of the polymer film thickness are used to probe physical mechanisms affecting printing instabilities, pattern fidelity, and edge resolution. Our experimental study indicates that this letterpress technique may prove suitable for high-throughput device fabrication involving large-area microelectronics.

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“…Hydrophobic or partially wetting surfaces are relevant to a number of technological applications ranging from nonstick surface treatments (Moilliet 1963;Kissa 2001) to offset printing (Senefelder 1911;Kipphan 2001;Darhuber et al 2001). Often they are applied if no liquid entrainment on a substrate or certain regions on it is desired.…”

Section: Introductionmentioning

confidence: 99%

Dry-spot nucleation in thin liquid films on chemically patterned surfaces

Brasjen

Darhuber

2011

Microfluid Nanofluid

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We systematically study the influence of chemical patterning on the instability of thin liquid films induced by chemical heterogeneities on a flat, horizontal, and partially wetting substrate. We consider common geometric shapes like wedges, circles, and stripes and determine the time required for nucleation of a dry-spot as a function of film thickness, contact angle, pattern dimensions, and geometry. Moreover, we characterized the resulting liquid distribution and identified conditions that avoid the formation of residual droplets on the less wettable regions, which is usually undesirable in technological applications.

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Physical mechanisms governing pattern fidelity in microscale offset printing

Cited by 55 publications

References 20 publications

Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self‐Assembly of Microdevices

Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self‐Assembly of Microdevices

Direct printing of polymer microstructures on flat and spherical surfaces using a letterpress technique

Dry-spot nucleation in thin liquid films on chemically patterned surfaces

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