Semiconductor Device Modelling 1989
DOI: 10.1007/978-1-4471-1033-0_7
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Physical Models for Compound Semiconductor Devices

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Cited by 6 publications
(8 citation statements)
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“…There is an alternative way of viewing the impact of flow of lateral current at the S/I interface outside the channel region in terms of source resistance R source . This resistance would give rise to extra voltage drop causing increase in threshold voltage, degradation in transconductance [29], and device speed. The model developed for effective source length is used to derive an analytical expression for source resistance in section 4.…”
Section: Current Crowding and Effective Source Lengthmentioning
confidence: 99%
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“…There is an alternative way of viewing the impact of flow of lateral current at the S/I interface outside the channel region in terms of source resistance R source . This resistance would give rise to extra voltage drop causing increase in threshold voltage, degradation in transconductance [29], and device speed. The model developed for effective source length is used to derive an analytical expression for source resistance in section 4.…”
Section: Current Crowding and Effective Source Lengthmentioning
confidence: 99%
“…A transmission-line model [29] is commonly used to understand current distribution and obtain expressions for contact resistance in inorganic semiconductor devices. In the transmission-line model, the current-voltage behavior is assumed to be linear and therefore the model uses resistors as its elements.…”
Section: Analytical Model For Effective Source Contact Lengthmentioning
confidence: 99%
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“…A phosphorous atom density of 2.8 × 10 15 cm -3 aligns well with the vendor-specified 1.3-2.5 cm resistivity of the silicon wafers utilized in the present studies. 38 Equation 2 yields b,n values assuming a phosphorus dopant density of 2.8 × 10 15 cm -3 based on an estimated wafer resistivity of 2.0 cm, and N c = 3.2 × 10 19 cm -3 , 39 and the extrapolated E FB values. For the impedance data depicted in Fig.…”
Section: Photoelectrochemistry Of N-si(111) In a Thin-layer Cell-figurementioning
confidence: 99%
“…This may be due to the fact that the energy gap difference (~2.8 eV) between A1N and GaN is larger than that (-0.75 eV) of AlAs and GaAs by a factor of about 4. Specifically, the piezoelectric constant of GaN is also larger than that of GaAs by a factor of about 4 [15].…”
mentioning
confidence: 98%