Physical properties of Sn58Bi–xNi lead-free solder and its interfacial reaction with copper substrate

Kanlayasiri, Kannachai; Ariga, Tadashi

doi:10.1016/j.matdes.2015.07.108

Cited by 61 publications

(27 citation statements)

References 41 publications

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“…The results indicate that Ni refined the microstructure of the solder matrix and induced the formation of the Ni 3 Sn 4 phase; furthermore, the formation and then continuously increasing concentration of Ni 3 Sn 4 were proportional to the increase of Ni added to the solder [29]. Thus, the optimal concentration of Ni added to enhance the solder's tensile strength should be less than 0.1 wt.% [29]. Nevertheless, the elongation of the alloy was in fact inversely proportional to the increase of the added Ni content, although the appropriate incorporation of Ni contributed positively to the wettability of the solder alloy [29].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 89%

“…Thus, the optimal concentration of Ni added to enhance the solder's tensile strength should be less than 0.1 wt.% [29]. Nevertheless, the elongation of the alloy was in fact inversely proportional to the increase of the added Ni content, although the appropriate incorporation of Ni contributed positively to the wettability of the solder alloy [29].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

“…The pin count increases to meet the demands of rapid signal transmission and high current load [28]. Thus, the electrical property of a solder becomes one of the most important factors [29][30][31]. In the literature, however, there is not much research on the electrical properties of low melting point solders.…”

Section: Electrical Conductivity Modification By Supplementation Withmentioning

confidence: 99%

“…This phenomenon was attributable to the fact that the addition of small amounts of Ni altered the composition of the alloy to resemble the eutectic composition of the ternary Sn-Bi-Ni alloy system [29]. …”

Section: Thermal Behavior (Melting Point and Melting Range) Accordingmentioning

confidence: 99%

“…0.05, 0.1, 0.5, and 1.0 wt.%) were individually added to Sn-58Bi samples, and respective microstructure, tensile strength, elongation, and wettability of Sn-58Bi-xNi were subsequently measured [29]. The results indicate that Ni refined the microstructure of the solder matrix and induced the formation of the Ni 3 Sn 4 phase; furthermore, the formation and then continuously increasing concentration of Ni 3 Sn 4 were proportional to the increase of Ni added to the solder [29]. Thus, the optimal concentration of Ni added to enhance the solder's tensile strength should be less than 0.1 wt.% [29].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

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Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

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The increasing application of heat-sensitive microelectronic components such as a multitude of transistors, polymer-based microchips, and so on, and flexible polymer substrates including polyethylene terephthalate (PET) and polyimide (PI), among others, for use in wearable devices has led to the development of more advanced, low melting temperature solders (<150°C) for interconnecting components in various applications. However, the current low melting temperature solders face several key challenges, which include more intermetallic compound formation (thus become more brittle), cost issues according to the addition of supplementary elements to decrease the melting point temperature, an increase in the possibility of thermal or popcorn cracking (reliability problems), and so on. Furthermore, the low melting temperature solders are still required to possess rapid electronic/electrical transport ability (high electrical conductivity and current density) and accompany strong mechanical strength sustaining the heavy-uploaded microelectronic devices on the plastic substrates, which are at least those of the conventional melting temperature solders (180-230°C). Thus, the pursuit of more advanced low melting temperature solders for interconnections is timely. This review is devoted to the research on three methods to improve the current properties (i.e., electrical and thermomechanical properties) of low melting temperature solders: (i) doping with a small amount of certain additives, (ii) alloying with a large amount of certain additives, and (iii) reinforcing with metal, carbon, or ceramic materials. In this review, we also summarize the overall recent progress in low melting temperature solders and present a critical overview of the basis of microscopic analysis with regard to grain size and solid solutions, electrical conductivity by supplementation with conductive additives, thermal behavior (melting point and melting range) according to surface oxidation and intermetallic compound formation, and various mechanical properties.

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Section: Recent Progress In Soldering Materials 26mentioning

confidence: 89%

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

Section: Electrical Conductivity Modification By Supplementation Withmentioning

confidence: 99%

Section: Thermal Behavior (Melting Point and Melting Range) Accordingmentioning

confidence: 99%

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

See 3 more Smart Citations

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

View full text Add to dashboard Cite

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Harsh service environment effects on the microstructure and mechanical properties of Sn–Ag–Cu-1 wt% nano-Al solder alloy

Gain

Zhang

2016

J Mater Sci: Mater Electron

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Effect of thin gold/nickel coating on the microstructure, wettability and hardness of lead-free tin–bismuth–silver solder

Gain

Zhang

2016

J Mater Sci: Mater Electron

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This paper investigates the coating thickness and surface morphology of gold/nickel (Au/Ni) layer on copper (Cu) substrate. A cross-sectioned SEM analysis confirmed that the Au/Ni coating was uniform. The top Au layer with average thickness of 0.7 lm appeared to have a very smooth surface without any defect such as cracks and delamination. However, the thin Au/Ni coating greatly influenced the interfacial structure and material properties of electronic interconnections. In the reference Cu substrate/Sn-Bi-Ag solder system, an island-shaped Cu 6 Sn 5 IMC layer at the interface could be clearly observed at the initial reaction stage. After a prolong reaction, a very thin Cu 3 Sn IMC layer was formed with excessive growth of the Cu 6 Sn 5 IMC layer which can deteriorate the electronic interconnection life-span. However, in the Au/Ni coated substrate/solder system, a very thin scallop-shaped ternary Ni 3 Sn 4 IMC layer formed without the Cu 3 Sn IMC layer, indicating that the Au/Ni coating hindered the growth of the IMC layer, which consequently changed the activation energies and refined the microstructure. Additionally, the overall micro-hardness of the Au/Ni coated substrate/solder system is higher than that of the reference solder system.

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Physical properties of Sn58Bi–xNi lead-free solder and its interfacial reaction with copper substrate

Cited by 61 publications

References 41 publications

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Harsh service environment effects on the microstructure and mechanical properties of Sn–Ag–Cu-1 wt% nano-Al solder alloy

Effect of thin gold/nickel coating on the microstructure, wettability and hardness of lead-free tin–bismuth–silver solder

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