2005
DOI: 10.4028/0-87849-963-6.849
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Physical Simulation of Drain-Induced Barrier Lowering Effect in SiC MESFETs

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“…A temperature of 300[K] is employed by default in simulations. By using those most recently published for 4H-SiC that provided the best agreement with the experimental date [12][13]. So, by the comparisons of experiment results as a calibration results, the simulation results could be verified in the UUSC structure.…”
Section: Device Structurementioning
confidence: 72%
“…A temperature of 300[K] is employed by default in simulations. By using those most recently published for 4H-SiC that provided the best agreement with the experimental date [12][13]. So, by the comparisons of experiment results as a calibration results, the simulation results could be verified in the UUSC structure.…”
Section: Device Structurementioning
confidence: 72%