Physico-chemical study of chalcone moiety containing epoxy resin and its fiber reinforced composites

Adroja, Pooja P.; Ghumara, Rizwan; Parsania, P. H.

doi:10.1080/15685551.2012.747168

Cited by 10 publications

(5 citation statements)

References 22 publications

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“…Epoxy resin (EP), with its excellent mechanical strength and insulation characteristics, has been widely used as a high performance resin in many elds such as adhesives, laminates, coatings and electrical insulation. [1][2][3] However, the ammability is a major drawback of epoxy resin and restricts its applications. Therefore, improving ame retardancy of EP is very important and necessary.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of a novel organophosphorus oligomer and its application in improving flame retardancy of epoxy resin

et al. 2014

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Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of a novel organophosphorus oligomer and its application in improving flame retardancy of epoxy resin

et al. 2014

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“…Endothermic DSC transition of ECH at 102 o C confirmed its melting transition and from thermogravimetric study it is confirmed that ECH is thermally stable up to about 225 o C and followed two-step degradation kinetics. 27 No crosslinking is observed in nitrogen atmosphere up to 225 o C. DSC curing kinetics of DGEBA with diamines have shown only one sharp exothermic peak regardless of heating rate and shifted towards atmosphere.…”

Section: Methodsmentioning

confidence: 94%

“…26 Epoxy resin of 1,3-bis(4-hydroxyphenyl)prop-2-en-1-one (ECH) used in this investigation was synthesized according to our recent work 27 Figures 1-3, respectively from which information about the nature of the curing reaction such as onset of curing reaction (T o ), peak temperature (T p ), the curing range and heat generated (DH) were derived from primary curves and are reported in Table I. From Table I, it is observed that the melting transition of ECH remained practically constant for DDE (102. o C) and DDS (100.7-102.5 o C) but it is decreased in case of PA (96.9-81.3 o C) with increasing hardener concentration.…”

Section: Methodsmentioning

confidence: 99%

Dynamic DSC curing kinetic study of epoxy resin of 1,3‐bis(4‐hydroxyphenyl) prop‐2‐en‐1‐one using aromatic diamines and phthalic anhydride

Adroja

Ghumara

Parsania

2013

J of Applied Polymer Sci

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Epoxy resin of 1,3-bis(4-hydroxyphenyl)prop-2-en-1-one has been synthesized and studied its cure kinetics by differential scanning calorimetry at four different heating rates in nitrogen atmosphere and varying proportions of 4,4 0 -diaminodiphenyl ether, 4,4 0 -diaminodiphenyl sulfone and phthalic anhydride. The energy of activation (E a ) and pre-exponential factor (A) has been determined according to Flyn-Wall-Ozawa method at various degrees of cure ranging from 0.1 to 0.9. The derived results are discussed in light of effect of hardeners concentrations, heating rates, degree of cure, and nature of hardeners, etc. The structure of the hardeners and their concentrations affected the cure behavior.

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“…Distyryl ketones and chalcones are generally synthesized by the Claisen–Schmidt reaction, in which benzaldehyde and methyl ketone undergo aldol condensation to form an unsaturated ketone in the presence of catalysts (Scheme a). To incorporate distyryl ketones or chalcones into different polymer resins including epoxy resins, benzoxazines, , polyethers or polyesters, benzaldehyde and methyl ketone bearing phenolic hydroxyl groups are often used as the reactants. For instance, the typical distyryl ketone 1,5-bis(4-hydroxyphenyl) penta-1,4-dien-3-one (BHPDO) and the typical chalcone 1,3-bis (4-hydroxyphenyl) prop-2-en-1-one (BHPEO) (their chemical structures are depicted in Scheme b,c, respectively), which both contain two phenolic hydroxyl groups, have already been used in the preparation of photocurable resins. , …”

Section: Introductionmentioning

confidence: 99%

Significant Efficacy of Desiccants in the Synthesis of Distyryl Ketones/Chalcones Bearing Phenolic Hydroxyl Groups

Zong

Wang

2022

Ind. Eng. Chem. Res.

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Complicated catalysts or rigorous synthesis methods are commonly necessary for the synthesis of distyryl ketones and chalcones bearing phenolic hydroxyl groups. Boron trifluoride etherate can serve as a type of high-efficiency catalyst for the synthesis of those products, but it will be quickly deactivated by the produced water during the reactions. However, the addition of an excessive amount of this catalyst will lead to serious side reactions and waste. In this work, by promptly removing the water produced from the reactions with the aid of desiccants, the products distyryl ketone and chalcone bearing phenolic hydroxyl groups are synthesized in high yield, as exemplified by the synthesis of 1,5-bis(4-hydroxyphenyl) penta-1,4-dien-3-one and 1,3-bis (4-hydroxyphenyl) prop-2-en-1-one, each representing very typical types of phenolic hydroxyl groups containing distyryl ketones and chalcones. The effects of desiccant species and dosages have been studied. On this basis, the species of desiccant is optimized as CaCl 2 , and then its proper dosage and the corresponding optimal reaction conditions are achieved.

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Physico-chemical study of chalcone moiety containing epoxy resin and its fiber reinforced composites

Cited by 10 publications

References 22 publications

Synthesis and characterization of a novel organophosphorus oligomer and its application in improving flame retardancy of epoxy resin

Synthesis and characterization of a novel organophosphorus oligomer and its application in improving flame retardancy of epoxy resin

Dynamic DSC curing kinetic study of epoxy resin of 1,3‐bis(4‐hydroxyphenyl) prop‐2‐en‐1‐one using aromatic diamines and phthalic anhydride

Significant Efficacy of Desiccants in the Synthesis of Distyryl Ketones/Chalcones Bearing Phenolic Hydroxyl Groups

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