Abstract:As the trend in electronic devices keeps striding towards minimization, high speed, high resolution, and multi-functions, the electromigration problem in chip packages becomes unavoidable, which creates an unintended electrical connection between terminals and causes electrical short, especially for high voltage products with COF package application. The aim of this study is to find a solution to prevent the phenomena from occurring. Therefore, we introduce the methodology of "PI under fill" in the gold bumped… Show more
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