Picosecond laser machining of deep holes in silicon infiltrated silicon carbide ceramics

Abstract

Silicon infi ltrated silicon carbide (Si-SiC) ceramics, as high hardness materials, are diffi cult to machine, especially drilling micro-holes. In this study, the interaction of picosecond laser pulses (1 ps at 1 030 nm) with Si-SiC ceramics was investigated. Variations of the diameter and depth of circular holes with the growth of the laser energy density were obtained. The results indicate that the increase of machining depth follows a nonlinear relation with the increasing of laser energy density, while the diameter has little change with that. Moreover, it is found that some debris and particles are deposited around and inside the holes and waviness is in the entrance and at walls of the holes after laser processing.

Discrete element modeling of the machining processes of brittle materials: recent development and future prospective

“…The processing of brittle materials such as ceramic, rock and glass are generally processed in precision and ultra-precision, especially in grinding [106][107][108][109] and polishing [110][111][112]. In addition to traditional machining methods such as cutting, milling and grinding, there are also some emerging auxiliary machining methods, such as: abrasive water-jet machining [113,114], laser-assisted machining [13,92,106,108,[115][116][117][118][119][120][121], ultrasonic machining [122][123][124][125][126][127][128], electron beam machining [129][130][131][132][133], chemical machining [112,134], electro-chemical machining [134] and so on. In the current literatures about the machining simulation of hard-brittle materials through DEM and its coupling method, a lot of works focus on studying the material removal mechanism, crack propagation, machining quality, and the optimization of the machining parameters.…”