2009
DOI: 10.1063/1.3194148
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Piezoelectric aluminum nitride nanoelectromechanical actuators

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Cited by 152 publications
(100 citation statements)
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“…[16] In an early comprehensive study of tribopolymer formation, Pt x Si formed from thin film Pt and a sc-Si wafer is described by a two-reaction process (Figure 1c). [23,24] Since common NEM switch geometries [2,25] demand silicidation away from the sc-Si carrier wafer, the sc-Si/Pt silicidation process is incompatible with NEM switch geometries, especially if co-integration with CMOS is desired. Furthermore, silicide-release using existing device topologies would require silicidation on both the top and bottom of features, which is not compatible with sc-Si/Pt process.…”
mentioning
confidence: 99%
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“…[16] In an early comprehensive study of tribopolymer formation, Pt x Si formed from thin film Pt and a sc-Si wafer is described by a two-reaction process (Figure 1c). [23,24] Since common NEM switch geometries [2,25] demand silicidation away from the sc-Si carrier wafer, the sc-Si/Pt silicidation process is incompatible with NEM switch geometries, especially if co-integration with CMOS is desired. Furthermore, silicide-release using existing device topologies would require silicidation on both the top and bottom of features, which is not compatible with sc-Si/Pt process.…”
mentioning
confidence: 99%
“…The deposition of AlN also allowed the mimicking of the topology of existing piezoelectrically-actuated NEM switch prototypes. [25] Thin layers of a-Si and Pt of 100-200 nm-thickness were subsequently sputter-coated on top of the AlN layer. The a-Si and Pt depositions were conducted sequentially in the same deposition system with vacuum maintained, thus minimizing adsorbed contamination between the layers and oxidation of the a-Si, both of which would inhibit silicidation.…”
mentioning
confidence: 99%
“…Therefore device scaling in terms of electrode width and film thickness ultimately yields a sensor with a better LOD for gas concentrations (or mass per unit area). Functional AlN films as thin as 50 and 100 nm [23][24][25][26][27] have been demonstrated and are the target thickness for the making of the CMR-S. In this paper 250 nm thick devices are presented.…”
Section: B Aln Contour-mode Resonant Sensor Designmentioning
confidence: 99%
“…The growth of aluminum nitride (AlN) thin film on a metal electrode has been widely studied because of its potential application in many devices, such as piezoelectric resonators, 1,2 nanoelectromechanical actuators, 3 and energy harvesting devices. 4 The piezoelectric properties of AlN strongly depend on the crystallinity, 5 c-axis orientation, 6 and polar distribution of the film structure.…”
mentioning
confidence: 99%