“…In the past few decades, by leveraging the wafer‐level and low‐cost micromachining processes, microelectromechanical system (MEMS) sensors such as inertial and pressure sensors have achieved a huge commercial success. [ 7 , 8 , 9 , 10 , 11 , 12 ] These MEMS sensors are able to be integrated into various wearable equipment or with other wearable sensors, exhibiting good integration compatibility, low power consumption, and negligible effect on the flexible and stretchable properties of wearable HMIs. [ 13 , 14 , 15 ] On the other hand, wearable HMIs can be directly fabricated from intrinsically flexible or stretchable materials, e.g., electronic skin, [ 16 , 17 , 18 , 19 ] electronic‐textile, [ 20 , 21 , 22 , 23 , 24 , 25 ] wearable patch, [ 26 , 27 , 28 ] etc.…”