2008
DOI: 10.1016/j.jeurceramsoc.2008.02.008
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Piezospectroscopic measurement of the stress field around an indentation crack tip in ruby using SEM cathodoluminescence

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Cited by 2 publications
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“…Residual stresses in ceramics have previously been investigated by curvature measurement (for machining stresses), 7 Xray diffraction, 3,11 neutron diffraction, 4 cathodoluminescence microscopy (CLM) [12][13][14] and photoluminescence microscopy (PLM). [1][2][3][4][5]15,16 PLM involves the illumination of the specimen by a laser focused through the objective lens of an optical microscope.…”
Section: Introductionmentioning
confidence: 99%
“…Residual stresses in ceramics have previously been investigated by curvature measurement (for machining stresses), 7 Xray diffraction, 3,11 neutron diffraction, 4 cathodoluminescence microscopy (CLM) [12][13][14] and photoluminescence microscopy (PLM). [1][2][3][4][5]15,16 PLM involves the illumination of the specimen by a laser focused through the objective lens of an optical microscope.…”
Section: Introductionmentioning
confidence: 99%