2006
DOI: 10.1016/j.msea.2006.05.081
|View full text |Cite
|
Sign up to set email alerts
|

Pinning of grain boundaries by second phase particles in equal-channel angularly pressed Cu–Fe–P alloy

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

2
25
0

Year Published

2012
2012
2023
2023

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 53 publications
(27 citation statements)
references
References 26 publications
2
25
0
Order By: Relevance
“…Obtained results are in accordance with literature [7][8][9][10][11][12][13][14][15][16][17][18][19][20]. Enhanced mobility of dislocations in Al and Cu due to the lack of alloying elements to hinder the dislocation movement results in weakening of grain refinement.…”
Section: Pure Cu and Cufe2 Alloysupporting
confidence: 88%
See 1 more Smart Citation
“…Obtained results are in accordance with literature [7][8][9][10][11][12][13][14][15][16][17][18][19][20]. Enhanced mobility of dislocations in Al and Cu due to the lack of alloying elements to hinder the dislocation movement results in weakening of grain refinement.…”
Section: Pure Cu and Cufe2 Alloysupporting
confidence: 88%
“…The second group of non-ferrous materials, which play a key role in electric engineering are copper and copper alloys. In literature the effectiveness of SPD methods has been revealed for a pure Al [7][8][9][10][11][12][13], Al-Mg alloys [13,14], pure Cu [11,[13][14][15][16][17][18][19] and Cu-Fe [20] alloys. Recent works have demonstrated [21,22] that one of the method which can be used for SPD processing is rolling with cyclic movements of rolls (RCMR).…”
Section: Introductionmentioning
confidence: 99%
“…The strengthening mechanism for Cu8Fe0.5Ag0.02P is that trace Ag refines the as-cast microstructure 5) and Fe 3 P precipitates inhibit the motion of Cu grain boundaries by typical secondary phase strengthening. 19,22) Therefore, fine as-cast microstructure produces small Fe filament spacing and the precipitated Fe 3 P particles pin the grain boundaries, which increases the strength of the composites. At the same time, extensive investigations showed that the electrical conductivity of CuFe in situ composites was primarily controlled by the resistivity of the Cu matrix, which could be portioned into the contribution of four scattering mechanism follows:…”
Section: Resultsmentioning
confidence: 99%
“…Kim et al 20,21) reported that Cu2.5Fe0.1P (mass%) alloys have particularly high strength and electrical conductivity with the precipitation of coarse Fe 3 P and fine £-Fe and ¡-Fe particles during heat treatment. Cao et al 22) observed the micro-hardness of deformed Cu2.2Fe0.085P (mass%) was enhanced due to the pinning effect caused by fine Fe 3 P particles. It is obvious that trace Ag or P can increase the strength and meanwhile the conductivity of CuFe composite.…”
Section: Introductionmentioning
confidence: 99%
“…It is well-known that the presence of second phase particles could potentially have a significant effect on the grain refinement [13][14][15][16][17]. No investigations have been performed however on the effect of second phase precipitates on grain refinement during (RCMR) in CuFe2 alloy.…”
Section: Introductionmentioning
confidence: 99%