Pixel level packaging for uncooled IRFPA

Dumont, G.; Rabaud, W.; Baillin, Xavier; Pornin, Jean-Louis; Carle, L.; Goudon, V.; Vialle, C.; Pellat, M.; Arnaud, A.

doi:10.1117/12.883852

Cited by 9 publications

(4 citation statements)

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“…An even more compact technology called pixel-level packaging (PLP) could further increase the performance of such architecture [29,30]. Simulations were done with 300 µm of air distance and 100 µm of germanium window; the results are illustrated in Fig.…”

Section: Placing the Filter Array Near The Fpamentioning

confidence: 99%

Three multispectral configurations of a snapshot kaleidoscope-based camera in long wavelength infrared spectral band

et al. 2020

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HAL is a multi-disciplinary open access archive for the deposit and dissemination of scientific research documents, whether they are published or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L'archive ouverte pluridisciplinaire HAL, est destinée au dépôt et à la diffusion de documents scientifiques de niveau recherche, publiés ou non, émanant des établissements d'enseignement et de recherche français ou étrangers, des laboratoires publics ou privés.

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Section: Placing the Filter Array Near The Fpamentioning

confidence: 99%

Three multispectral configurations of a snapshot kaleidoscope-based camera in long wavelength infrared spectral band

et al. 2020

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“…To enable compact and lightweight system for smaller format detectors, ceramic packages have been developed. High performance ¼ VGA detector is therefore packaged in a compact (24.13 x 24.13 x 3.57 mm 3 ), low weight (< 6 g) and TEC-less ceramic package. Regarding the environmental tests, this package design is compliant with the automotive AEC-Q -100 / Grade 3 standard.…”

Section: Ceramic Packagementioning

confidence: 99%

“…The cost objectives for small sensors (alarm sensors or abandoned sensors) however require a technological breakthrough, particularly in regard to the vacuum packaging of these components, which remains an adverse cost driver for any microbolometer technologies. In this context, CEA-LETI has proposed the PLP technology development for some years [3][4][5] . According to this unique technology, each bolometer pixel is sealed under vacuum directly at the wafer level, using an IR transparent thin film deposition.…”

Section: Pixel Level Packagementioning

confidence: 99%

Status of Uncooled Infrared Detector Technology at ULIS, France

Tissot¹,

Robert²,

Durand³

et al. 2013

DSJ

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“…There are several vacuum packaging methods reported including die level packaging [13][14][15][16] and wafer level packaging [17][18][19][20][21][22]. There are also efforts to make pixel level vacuum packaging where the packaging process is the part of detector fabrication process [23][24][25][26][27][28][29][30][31][32]. By this method, the need for expensive packaging equipment like a wafer bonder can be eliminated.…”

Section: Introductionmentioning

confidence: 99%

Pixel level vacuum packaging for single layer microbolometer detectors with on pixel lens

Tanrikulu

2022

Journal of Electrical Engineering

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This paper presents a new approach for fabrication of single layer microbolometer detectors featuring pixel level vacuum packaging together with a lens on the pixel. The proposed lens structure can be used to increase the fill factor of the detector so that the pixel size can be decreased without decreasing the minimum feature size in the detector which is a problem in single layer microbolometers. The designs of the lens and the fabrication process of pixel level vacuum packaged microbolometer detector together with this lens are given in the framework of this study. The optical and mechanical simulations of the structure are performed. The radius of curvature of the lens is optimized to be 25 μm and it is shown that the condensing efficiency is 100% for 3 μm lens-detector distance. The deflection in the lens structure is found approximately as 0.8 nm in 1 atm environment pressure, showing that the proposed structure is durable. The proposed structure increases the fill factor to twice of the original value without decreasing the minimum feature size in the fabrication processes, resulting in the same amount of improvement in the performance of the detector. This approach can also be used to increase the yield and decrease the fabrication cost of single layer and also standard microbolometers with small pixel sizes, as it integrates the vacuum packaging in the fabrication steps.

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Pixel level packaging for uncooled IRFPA

Cited by 9 publications

References 0 publications

Three multispectral configurations of a snapshot kaleidoscope-based camera in long wavelength infrared spectral band

Three multispectral configurations of a snapshot kaleidoscope-based camera in long wavelength infrared spectral band

Status of Uncooled Infrared Detector Technology at ULIS, France

Pixel level vacuum packaging for single layer microbolometer detectors with on pixel lens

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