Planar and Three-Dimensional Printing of Conductive Inks

3D printed electronics with nanomaterials

“…With the use of silver NPs with loading as high as 60-80 wt%, electrical conductivity in the range of 10 7 S m −1 , close to the values of bulk silver or copper is possible. 150,[285][286][287][288] Although the DIW technique is often used for planar applications, with this technique it is possible to fabricate conductive 3D printed structures such as coils or grids (Fig. 5b).…”

“…108,148 A modification of this process uses an additional shear thinning fluid, or a high viscosity gel, as a supporting matrix in a reservoir, with a nozzle injecting a low viscosity filler material into this supporting matrix. 149 In standard DIW equipment, the minimum feature size is in the range of 1-500 μm, heavily ink dependent, 148,150,151 and the printing speed defined by the volume of the extruded paste via the nozzle is in the range of 100-1000 mL h −1 . 148,152,153 Other process parameters related to the XY and Z axis resolution remain similar to the FDM technique due to many similarities in the equipment construction.…”