Planarization of Substrate Topography by Spin Coating

Stillwagon, L. E.; Larson, Ronald G.; Taylor, G.W.

doi:10.1149/1.2100813

Cited by 79 publications

(57 citation statements)

References 7 publications

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“…Early examples, featuring complementary long wavelength analysis, include [21,22,23] and [24] who considered radial outflow during spin coating and gravity-driven flow down an inclined plane, respectively. A key finding by both sets of authors was that lubrication theory proved surprisingly accurate for their modelling purposes; in addition [23] are credited as being the first to obtain a one-dimensional analytic expression for the standing capillary wave which forms at the leading edge of a trench topography and its associated downstream exponential decay.…”

Section: Introductionmentioning

confidence: 99%

Inertial thin film flow on planar surfaces featuring topography

et al. 2010

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Published paperAbstract A range of problems is investigated, involving the gravity-driven inertial flow of a thin viscous liquid film over a planar surface containing topographical features, modelled via a depth-averaged form of the governing unsteady Navier-Stokes equations. The discrete analogue of the resulting coupled equation set, employing a staggered mesh arrangement for the dependent variables, is solved accurately using an efficient Full Approximation Storage (FAS) algorithm and Full Multigrid (FMG) technique together with adaptive timestepping and proper treatment of the nonlinear convective terms. A unique, comprehensive set of results is presented for both one-and two-dimensional topographical features, and errors quantified via detailed comparisons drawn with complementary experimental data and predictions from finite element analyses where they exist. It is found in the case of one-dimensional (spanwise) topography that for small Reynolds number and shallow/short features the depth-averaged form produces results that are in close agreement with corresponding finite element solutions of the full free-surface problem. For the case of flow over two-dimensional (localised) topography the free-surface disturbance observed is influenced significantly by the presence of inertia. It leads, as in the case of spanwise topography, to an increase in the magnitude and severity of the capillary ridge/trough patterns which form.

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Section: Introductionmentioning

confidence: 99%

Inertial thin film flow on planar surfaces featuring topography

et al. 2010

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“…The combination organic film and dielectric are then etched in a plasma environment that has been designed to produce equal etch rates in both materials. The limitations of this process have been documented [Sti87].…”

Section: Process Overviewmentioning

confidence: 99%

Extraction of Topography Dependent Electrical Characteristics from Process Simulation Using SIMPL, with Application to Planarization and Dense Interconnect Technologies

Scheckler¹

1989

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Public reporting burden for the collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Washington Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington VA 22202-4302. Respondents should be aware that notwithstanding any other provision of law, no person shall be subject to a penalty for failing to comply with a collection of information if it does not display a currently valid OMB control number. SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES) 10. SPONSOR/MONITOR'S ACRONYM(S) SPONSOR/MONITOR'S REPORT NUMBER(S) DISTRIBUTION/AVAILABILITY STATEMENTApproved for public release; distribution unlimited SUPPLEMENTARY NOTES ABSTRACTThis project demonstrates the use of SIMPL-2 (SIMulated Profiles from the Layout) and SIMPL-DIX (Design interface with X windows) as an interface to other process and device simulators. An interface to RACPLE for analyzing topography dependent parasitic resistances and capacitances is implemented. Enhancements to SIMPL to call the non-planar etch simulation capabilities of SAMPLE are also presented. These integrated CAD tools are applied to a patterned photoresist planarization process, and to VLSI Hopfield neural networks. It is found that the patterned photoresist planarization process shows a relatively high tolerance to reasonable misalignments. VLSI neural networks show significant topography dependent RC parasitic delays which increase as the square of the number of neurons. Based on experience gained as a result of this work, several suggestions for the future of SIMPL are offered. ABSTRACTThis project demonstrates the use of SIMPL-2 (SIMulated Profiles from the Layout) and SIMPL-DIX (Design interface with X windows) as an interface to other process and device simulators. Ari interface to RACPLE for analyzing topography dependent parasitic resistances and capacitances is implemented. Enhancements to SIMPL to call the non-planar etch simulation capabilities of SAMPLE are also presented. These integrated CAD tools are applied to a patterned photoresist planarization process, and to VLSI Hopfield neural networks. It is found that the patterned photoresist planarization process shows a relatively high tolerance to reasonable misalignments. VLSI neural networks show significant topography dependent RC parasitic delays which increase as the square of the number of neurons. Based on experience gained as a result of this work, several suggestions for the future of SIMPL are offered. December 19, 1988 Dedicated to my family wilh thanks for lheir continued love and support throughout my education.Acknowledgements I have been fortunate to have the support of many people in...

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“…Several authors have used asymptotic methods to describe various aspects of the spin-coating process, such as fluid flow for low and high Reynolds number [15], and the relative importance of inertial, gravitational and surface tension forces on film thinning and planarization [19,26,31]. Other authors have considered the spin-coating model subject to substrate topography allowing for surface tension [29], radial dependent surface roughness [16,21], and air shear at the fluid surface [17]. The additional complexity of non-Newtonian fluids has also been studied.…”

Section: Introductionmentioning

confidence: 99%