Plasma assisted bonding of copper and silver substrates

Abstract

In this research, copper and silver substrates have been bonded by plasma activated bonding method at 190 • C. Furtheremore, addtional formic acid process after plasma process for both surfaces had effect to be bonded more tightly. The surface conditions were analyzed by SEM, AFM and XPS. As results, silver surfaces were etched and smoothed by plasma, and the surface oxidation adsorbent was removed, according to XPS O1s spectra. Moreover, oxidation layer of silver surface was reduced by formic acid process. On the other hand, copper surface was less changed by plasma, but copper surface was also reduced, and copper precipitation was observed on the surface by formic acid process.

Copper-filled anodized aluminum oxide a potential material for low temperature bonding for 3D packaging

“…It is necessary to manage the surface very precisely and the processing such as grinding precise and making to surfaceactive is needed though the technology named SAB(Surfaceactivated Bonding) and ADB(Atomic Diffusion Bonding) that makes addition to the device a minimum is developed. [2][3] [4] Moreover, the system requirements becomes severe and use at the high temperature is requested in the power device from which the development in the future is expected though the material named SiC is used. It is not possible to endure with such a case by connecting the past solder.…”