Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV 2021
DOI: 10.1117/12.2584607
|View full text |Cite
|
Sign up to set email alerts
|

Plasma assisted particle contamination control: plasma charging dependence on particle morphology

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2021
2021
2023
2023

Publication Types

Select...
2

Relationship

1
1

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 0 publications
0
1
0
Order By: Relevance
“…For applications, the effects of dust can be detrimental to, e.g. fusion energy reactors [3,26] and plasmas created in semiconductor manufacturing [4,27], which led to recent work focused on contamination control using plasmas [28][29][30]. The charge state of the dust particles in contact with the plasma is often a decisive factor in the dust retention mechanism.…”
Section: Introductionmentioning
confidence: 99%
“…For applications, the effects of dust can be detrimental to, e.g. fusion energy reactors [3,26] and plasmas created in semiconductor manufacturing [4,27], which led to recent work focused on contamination control using plasmas [28][29][30]. The charge state of the dust particles in contact with the plasma is often a decisive factor in the dust retention mechanism.…”
Section: Introductionmentioning
confidence: 99%