Silk fibroin is an
excellent candidate for biomedical implantable devices because of
its biocompatibility, controllable biodegradability, solution processability,
flexibility, and transparency. Thus, fibroin has been widely explored
in biomedical applications as biodegradable films as well as functional
microstructures. Although there exists a large number of patterning
methods for fibroin thin films, multilayer micropatterning of fibroin
films interleaved with metal layers still remains a challenge. Herein,
we report a new wafer-scale multilayer microfabrication process named
aluminum hard mask on silk fibroin (AMoS), which is capable of micropatterning
multiple layers composed of both fibroin and inorganic materials (e.g.,
metal and dielectrics) with high-precision microscale alignment. To
the best of our knowledge, our AMoS process is the first demonstration
of wafer-scale multilayer processing of both silk fibroin and metal
micropatterns. In the AMoS process, aluminum deposited on fibroin
is first micropatterned using conventional ultraviolet (UV) photolithography,
and the patterned aluminum layer is then used as a mask to pattern
fibroin underneath. We demonstrate the versatility of our fabrication
process by fabricating fibroin microstructures with different dimensions,
passive electronic components composed of both fibroin and metal layers,
and functional fibroin microstructures for drug delivery. Furthermore,
because one of the crucial advantages of fibroin is biocompatibility,
we assess the biocompatibility of our fabrication process through
the culture of highly susceptible primary neurons. Because the AMoS
process utilizes conventional UV photolithography, the principal advantages
of our process are multilayer fabrication with high-precision alignment,
high resolution, wafer-scale large area processing, no requirement
for chemical modification of the protein, and high throughput and
thus low cost, all of which have not been feasible with silk fibroin.
Therefore, the proposed fabrication method is a promising candidate
for batch fabrication of functional fibroin microelectronics (e.g.,
memristors and organic thin film transistors) for next-generation
implantable biomedical applications.