1983
DOI: 10.1016/0040-6090(83)90301-2
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Plasma nitriding and ion plating with an intensified glow discharge

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1984
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Cited by 50 publications
(9 citation statements)
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“…However, in relation to the system presented here, the existing nitrided layer was already a kind of interlayer between the steel substrate and the PVD coating, as there is general agreement on the good suitability of nitriding pre-treatments for subsequent hard coating. 8,[11][12][13] What is of greater importance is whether a CL is formed during the nitriding process, because this can be viewed as a further interlayer and must be considered in a differentiated manner. In such cases where a CL does not dissociate during the PVD process and instead remains intact, it can be assumed to be beneficial for the stability of the duplex layer system because of the smoother hardness and stiffness gradients that result.…”
Section: Discussionmentioning
confidence: 99%
“…However, in relation to the system presented here, the existing nitrided layer was already a kind of interlayer between the steel substrate and the PVD coating, as there is general agreement on the good suitability of nitriding pre-treatments for subsequent hard coating. 8,[11][12][13] What is of greater importance is whether a CL is formed during the nitriding process, because this can be viewed as a further interlayer and must be considered in a differentiated manner. In such cases where a CL does not dissociate during the PVD process and instead remains intact, it can be assumed to be beneficial for the stability of the duplex layer system because of the smoother hardness and stiffness gradients that result.…”
Section: Discussionmentioning
confidence: 99%
“…Between the low-voltage ( several kV)/high-pressure (ten to thousands of Pa) conditions used in conventional plasma nitriding [7,8] and the high-voltage (up to 100 kV)/lowpressure (∼10 −2 Pa) conditions used in PIII [1-5, 9, 10], there exists a medium-voltage (tens of kV)/medium-pressure (0.1 to several Pa) process window to conduct pulsed high-voltage glow discharge treatment. In this process, the plasma is sustained by the glow discharge when a voltage is applied to the objects.…”
Section: Introductionmentioning
confidence: 99%
“…For many applications, however, the temperatures which are r e q~r e d for thermal nitridation are too high. Therefore, attempts were made to use nitrogen plasmas which were successful in the cases of magnesium [2], titanium [3], and silicon [4,5], but to our knowledge not in the case of aluminium so far [6]. Low-temperature conversion of aluminium films into aluminium nitride has been demonstrated by high-energy ion implantation only [7,8].…”
Section: Introductionmentioning
confidence: 99%