2013
DOI: 10.1016/j.surfcoat.2013.09.035
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Plasma parameter investigation during plasma-enhanced chemical vapor deposition of silicon-containing diamond-like carbon films

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Cited by 14 publications
(11 citation statements)
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“…In contrast, when ammonia gas was introduced into the gas mixture, the dominating emission lines over the OES spectrum ( Figure 1b) were quite different from those of the glow discharge of the TMS-O 2 gas mixture. As referred to in the inset OES spectrum of Figure 1b, measured from the pure ammonia plasma, the peaks at about 314, 335, 356, and 390 nm were attributed to the transition lines of the nitrogen molecules (N 2 ) and the ions of the nitrogen molecules (N 2 + ) [23,24]. The emission peaks at 426, 485, and 655 nm, in turn, corresponded to the molecular and atomic emissions of excited H 2 , H β , H α [20,25].…”
Section: Resultsmentioning
confidence: 81%
“…In contrast, when ammonia gas was introduced into the gas mixture, the dominating emission lines over the OES spectrum ( Figure 1b) were quite different from those of the glow discharge of the TMS-O 2 gas mixture. As referred to in the inset OES spectrum of Figure 1b, measured from the pure ammonia plasma, the peaks at about 314, 335, 356, and 390 nm were attributed to the transition lines of the nitrogen molecules (N 2 ) and the ions of the nitrogen molecules (N 2 + ) [23,24]. The emission peaks at 426, 485, and 655 nm, in turn, corresponded to the molecular and atomic emissions of excited H 2 , H β , H α [20,25].…”
Section: Resultsmentioning
confidence: 81%
“…Using mass flow controllers the gas flow rates can be adjusted. The process pressure is induced with a rotary vane pump (Pfeiffer DUO 65C) and a turbo molecular pump (Leybold Turbovac 450) . Improved adhesion of the coating is realized using a 500 nm thick silicon-based TMS undercoating (trimethylsilyl).…”
Section: Experimental Sectionmentioning
confidence: 99%
“…Independently controlled process variables, such as power, pressure, and gas composition, determine the internal plasma variables, such as the electron temperature, electron density, and species fluxes to various surfaces, which in turn affect the composition and properties of the films deposited via PECVD [1,6,7]. Understanding interrelations between these various quantities informs process parameter choices so that particle fluxes, surface reactions, and film properties can be controlled rationally [8,9].…”
Section: Introductionmentioning
confidence: 99%