Comprehensive Materials Processing 2014
DOI: 10.1016/b978-0-08-096532-1.00426-x
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Plasma Polymer Deposition and Coatings on Polymers

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Cited by 37 publications
(38 citation statements)
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“…Likewise, the deposited (transferred) momentum during film growth can be given by πsurf=2mnormaliEnormalinormalΓnormaliR=2Enormalin0kTnormaleRcosθ with the average ion mass m i (which is crossed out in the right hand side of Equation (5)) and the factor cos θ considering collisions (which is roughly 0.2 for CO 2 /C 2 H 4 discharges at 10 Pa) . Note that an additional factor of up to two might be used when bouncing particles (ions) are considered which keep part of their energy.…”
Section: Resultsmentioning
confidence: 84%
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“…Likewise, the deposited (transferred) momentum during film growth can be given by πsurf=2mnormaliEnormalinormalΓnormaliR=2Enormalin0kTnormaleRcosθ with the average ion mass m i (which is crossed out in the right hand side of Equation (5)) and the factor cos θ considering collisions (which is roughly 0.2 for CO 2 /C 2 H 4 discharges at 10 Pa) . Note that an additional factor of up to two might be used when bouncing particles (ions) are considered which keep part of their energy.…”
Section: Resultsmentioning
confidence: 84%
“…For all data sets examined, the same slope of the Arrhenius regime can now be observed (Figure b), i.e., the plasma polymer film depositions indeed follow the same plasma chemical reaction pathway. As it was discussed in previous papers, the mass deposition rate R m within the Arrhenius regime can be described by Rnormalm=FnormalmAdepGexptrue(ϵnormalaϵpltrue), where A dep is the deposition area (electrode size), ϵ a is the (apparent) activation energy, and G′ is the reactor‐dependent factor comprising the sticking probability, the molecular mass of the film‐forming species, and the energy transfer efficiency (which depends on the plasma source and the size of the reactor, i.e., on the electron energy distribution function) …”
Section: Resultsmentioning
confidence: 85%
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“…Khatir et al [2] used inductively coupled plasma-assisted sputtering to deposit Diamond-like carbon (DLC) on polymer substrates to enhance chemical and electrical properties. Hegemann [3] has recently reported plasma polymer coatings on polymer materials. Similarly, Abbas et al [4] and Ogino et al [5] had improved the gas barrier properties by depositing DLC coating on polymer substrates using plasma chemical vapor deposition technique.…”
Section: Introductionmentioning
confidence: 99%
“…The motivation for the current work is to propose and validate a model that correlates flowability factor with user‐set plasma parameters. Since the flowability increase experienced by a plasma‐modified powder is a consequence of a plasma‐coating deposition on its surface, we assume that the flowability‐factor ( ff ) increment is a function of the plasma mass deposition rate R , which is in turn a function of the plasma process parameters ffff0=f(R(W,F,p,G)) where ff 0 is the flowability factor of the unprocessed powder, W is the plasma power, F is the monomer molar flow rate into the plasma, p is the plasma pressure, and G is a factor that accounts for reactor geometry and monomer conversion into deposit products …”
Section: Introductionmentioning
confidence: 99%