Plasma polymerization of ethylene in an atmospheric pressure‐pulsed discharge

Abstract

SynopsisThe polymerization of ethylene in an atmospheric pressure-pulsed discharge has been studied.Partial pressures of ethylene up to 4 kN/m2 were used with helium as a diluent. Deposition rates (on glass slides) were the same throughout the discharge volume over a wide range of operating conditions. These rates were in the 1-2 &.ec range. The films were clear, soft, and showed good adhesion to the glass substrates. Oligomers large enough to visibly scatter 637.8-nm light were observed in the gas phase under all conditions in which film deposition occurred. The experimental results suggest that Brownian diffusion of these oligomers was the rate-limiting step in the film deposition process.

Improving the bonding between henequen fibers and high density polyethylene using atmospheric pressure ethylene-plasma treatments

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Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Plasma Graft Copolymerization and UV‐induced Graft Copolymerization with 4‐Vinylpyridine

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