Plasma Sheath Processes.

Long, W. H.

doi:10.21236/ada070819

Cited by 6 publications

(2 citation statements)

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“…[17][18][19][20][21][22] With structural and compositional tunability, crystallinity, framework rigidity, high porosity, and biodegradability, nMOFs have been used to incorporate PSs for PDT. [23][24][25][26] The crystalline and rigid frameworks of nMOFs prevent photobleaching and selfquenching of PSs to significantly increase PDT efficacy. 27,28 The dimensionality of nMOFs can be reduced to afford nanoscale metal-organic layers (nMOLs) with monolayer thickness, which further enhances ROS diffusion for cytotoxic effects on tumor cells.…”

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confidence: 99%

Nanoscale Metal–Organic Layer Isolates Phthalocyanines for Efficient Mitochondria-Targeted Photodynamic Therapy

et al. 2021

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Zinc-phthalocyanine (ZnPc) photosensitizers (PSs) have shown great potential in photodynamic therapy (PDT) owing to their strong absorption at long wavelengths (650-750 nm), high triplet quantum yields, and biocompatibility. However, the clinical utility of ZnPc PSs is limited by their poor solubility and tendency to aggregate in aqueous environments. Here we report the design of a new nanoscale metal-organic layer (nMOL) assembly, ZnOPPc@nMOL, with ZnOPPc [ZnOPPc = zinc(II)-2, 3,9,10,16,17,23,24-octa(4-carboxyphenyl)phthalocyanine] PSs supported on the

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confidence: 99%

Nanoscale Metal–Organic Layer Isolates Phthalocyanines for Efficient Mitochondria-Targeted Photodynamic Therapy

et al. 2021

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“…The answer is that this can be done (relatively easily) using established techniques as long as the electric field does not vary significantly in space, or if the field profile is specified (Kushner, 1983;Boeuf and Marode, 1982;Winkler et al, 1987;Moratz et al, 1987;and Sato and Tagashira, 1985). Some work has been done in solving the Boltzmann equation for electrons assuming only forward and backward scattering, along with the ion continuity equation and Poisson's equation for a DC glow discharge (Long, 1979;Duke, 1985). However, it is difficult to see how this approach could be readily extended to the discharges typically used in plasma processing.…”

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confidence: 99%

Plasma processing in microelectronics manufacturing

Graves

1989

AIChE Journal

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Plasma processing has emerged as an important technology for the deposition and etching of thin solid films in the manufacture of microelectronic devices. In fact, much of the progress achieved to date in device miniaturization would have been much more difficult without the unique characteristics of plasma processes. It is anticipated that future progress will continue to rely heavily on plasma technology. Although plasma chemical reactors are widely used, a lack of fundamental understanding has resulted in heavy reliance on empiricism in process design and control. The complexities inherent in any chemical reactor are compounded in plasma processing by the presence and active participation of the discharge in both gas phase and surface chemical processes. This has resulted in a technology that is sensitive to many design and operating parameters. A large parameter space gives process engineers flexibility in tailoring process conditions to meet objectives. However, without fundamental insight into the key physical and chemical processes, reactor design and control cannot be based on systematic, rational procedures. The purposes of this review are to introduce chemical engineers to plasma processing practice and phenomenology; to outline the progress made to date in fundamental studies of discharge physics and chemistry; to indicate areas in which chemical engineers must expand their traditional training to participate in plasma processing research; and finally to suggest how established chemical engineering methodology can be applied to plasma chemical reactors. David B. Graves Department of Chemical EngineeringUniversity of California Berkeley, CA 94720Introduction to Plasma Processing History, motivation, and future prospects Molecular gas plasmas are currently widely used in the microelectronics industry for the deposition and etching of thin solid films. Plasma processing is one of many techniques and processes used in the manufacture of integrated circuits (Doane et al., 1982), but the importance of plasma processing to present and future developments in microelectronics, coupled with the growing interest in this technology by chemical engineers, justifies a closer look at industrial practice and the underlying science. Simply stated, microelectronics manufacturing amounts to the growth, patterning, and doping of multiple layers of insulating, semiconducting, and conducting thin films (Hess, 1979). Consequently, deposition and selective etching of films is fundamental to many of the steps involved in this industry. It happens that chemically reacting, weakly ionized gas discharges are particularly powerful tools for depositing and removing thin films.Plasma etching is the more important process industrially, with VLSI (very large scale integration) relying upon the superior pattern transfer fidelity possible with plasma etching (a more or less equivalent term is reactive-ion etching). The utility of plasmas for etching hinges on their ability, under certain conditions, to remove material in the direction p...

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Discharge Modeling

Boeuf¹,

Kunhardt²

1987

Swarm Studies and Inelastic Electron-Molecule Collisions

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Plasma Sheath Processes.

Cited by 6 publications

References 4 publications

Nanoscale Metal–Organic Layer Isolates Phthalocyanines for Efficient Mitochondria-Targeted Photodynamic Therapy

Nanoscale Metal–Organic Layer Isolates Phthalocyanines for Efficient Mitochondria-Targeted Photodynamic Therapy

Plasma processing in microelectronics manufacturing

Discharge Modeling

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