Interfacial bonding strength of an
epoxy-based adhesive depends
on the interfacial interaction between the adhesive and the substrate.
Normally, the curing process at the interface accompanied by the interfacial
bonding formation is different from that in the bulk, and it is still
a big challenge to probe the interfacial bonding formation at a molecular
level. In this study, to trace the interfacial structural evolution
of a representative formula of epoxy (digylcidyl ether of biphenyl
A, DGEBA) and amine hardener [1,2-bis(2-aminoethoxy)ethane, EDDA]
with the sapphire and silica substrates upon curing and post-curing
steps, sum frequency generation (SFG) vibrational spectroscopy is
employed to detect the molecular-level interfacial structural information.
For the sapphire substrate, upon curing, backbone methylene (CH2) stretching signals decrease, indicating the formation of
a rigid chain network structure and thus losing the local methylene
order, while vibrational signals of the sapphire surface hydroxyl
(OH) groups (including hydrogen-bonded and unbonded) increase significantly,
indicating the formation of a strong hydrogen-bonding and polar interaction
between the epoxy adhesive and the sapphire surface. Upon post-curing,
increased backbone CH2 signals and decreased sapphire OH
signals suggest interfacial chemical bonding formation due to the
reaction between the epoxy rings and the sapphire surface OH groups.
Orientation analysis confirms the enhanced ordering of the sapphire
surface OH groups upon curing and post-curing, in comparison to the
uncured epoxy formula. As for the fused silica, weak vibrational signals
of the methylene (CH2) and methyl (CH3) groups
are observed before curing, while both of them increase slightly for
the cured and post-cured epoxy formulae, suggesting relatively less
hydrophilic nature of the silica surface compared to that of the sapphire
surface, also evidenced by the very weak OH signals upon curing and
post-curing. Further measurement on the adhesion strength matches
up with the above spectroscopic experimental results, substantiating
the correlation between the macroscopic bonding strength of the epoxy
adhesive and the microscopic molecular-level structure.