2022
DOI: 10.1007/s11664-022-09703-7
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Plasma Treatment for Surface Stabilization in InAs/GaSb Type-II Superlattice LWIR and VLWIR Photodetectors

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Cited by 2 publications
(2 citation statements)
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“…3. First, LWIR absorber of each pixel was isolated by fully etching from the top contact layer to the barrier layer using inductively coupled plasma reactive ion etch (ICPRIE) under following conditions [15]: process temperature 200 °C, working pressure 6.66  10 −4 kPa, BCl3 flow 5 sccm, RF power 270 W, and ICP power 300 W. And then, to alleviate a potential surface damage of the etched LWIR absorber caused by plasma radicals, hydrogen (H2) plasma treatment was in situ performed using ICPRIE under following conditions [16,17]: process temperature 200°C, working pressure 6.66  10 −4 kPa, H2 flow 5 sccm, RF power 30 W, and ICP power 500 W. After SiO2 passivation film was deposited using an inductively coupled plasma chemical vapour deposition (ICPCVD) equipment to protect the surface of the LWIR absorber, the first MESA process for isolating the LWIR pixels was finished. Second, MWIR absorber of each pixel was isolated by fully etching from the barrier layer to the bottom contact layer under the same conditions as the pixel isolation process of the LWIR absorber.…”
Section: Device Fabricationmentioning
confidence: 99%
“…3. First, LWIR absorber of each pixel was isolated by fully etching from the top contact layer to the barrier layer using inductively coupled plasma reactive ion etch (ICPRIE) under following conditions [15]: process temperature 200 °C, working pressure 6.66  10 −4 kPa, BCl3 flow 5 sccm, RF power 270 W, and ICP power 300 W. And then, to alleviate a potential surface damage of the etched LWIR absorber caused by plasma radicals, hydrogen (H2) plasma treatment was in situ performed using ICPRIE under following conditions [16,17]: process temperature 200°C, working pressure 6.66  10 −4 kPa, H2 flow 5 sccm, RF power 30 W, and ICP power 500 W. After SiO2 passivation film was deposited using an inductively coupled plasma chemical vapour deposition (ICPCVD) equipment to protect the surface of the LWIR absorber, the first MESA process for isolating the LWIR pixels was finished. Second, MWIR absorber of each pixel was isolated by fully etching from the barrier layer to the bottom contact layer under the same conditions as the pixel isolation process of the LWIR absorber.…”
Section: Device Fabricationmentioning
confidence: 99%
“…The MWIR absorber layer was grown earlier and thicker than LWIR absorber to minimize a spectral crossover when infrared is incident on the backside of the dual-band FPA [13]. The dual-band MWIR/LWIR FPA was fabricated following the process sequence of the InAs/GaSb LWIR nBn devices reported in previous studies [13,14,15,16,17]: dry-etch for pixel isolation, post-treament, passivation film deposition, electrode area etching, and metallization. However, the dual-band nBn device should be dry-etched more deeply than the single-band nBn device for pixel isolation because of the thicker absorber layer including MWIR and LWIR absorbers.…”
Section: Epi Structure and Device Fabricationmentioning
confidence: 99%