Plasma Treatment Technologies for GaN Electronics

Abstract

Nowadays, the third-generation semiconductor led by GaN has brought great changes to the semiconductor industry. Utilizing its characteristics of a wide bandgap, high breakdown Electric field, and high electron mobility, GaN material is widely applied in areas such as 5G communication and electric vehicles to improve energy conservation and reduce emissions. However, with the progress in the development of GaN electronics, surface and interface defects have become a main problem that limits the further promotion of their performance and stability, increasing leakage current and causing degradation in breakdown voltage. Thus, to reduce the damage, Plasma treatment technologies are introduced in the fabrication process of GaN electronics. Up to now, designs like the high-resistivity p-GaN cap Layer, passivating termination, and surface recovery process have been established via Plasma treatment, reaching the goals of normally-off transistors, diodes with high breakdown voltage and high-reliability GaN electronics, etc. In this article, hydrogen, fluorine, oxygen, and nitrogen Plasma treatment technologies will be discussed, and their application in GaN electronics will be reviewed and compared.