Plasmonic piezoelectric nanomechanical resonator for spectrally selective infrared sensing

Huang, Yu; Gómez‐Díaz, J. S.; Qian, Zhenyun; Alù, Andrea; Rinaldi, Matteo

doi:10.1038/ncomms11249

Cited by 160 publications

(117 citation statements)

References 45 publications

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“…In particular, thermal detection capabilities comparable to or even outperforming conventional microbolometers have been demonstrated 17,18 . The fundamental challenges for the implementation of fast, high-resolution piezoelectric MEMS/NEMS resonant IR detectors are the scaling of the device thickness in the nanoscale range and the simultaneous achievement of high IR absorption in such a deep subwavelength thickness, without sacrificing the electromechanical performance.…”

Section: Introductionmentioning

confidence: 99%

Graphene–aluminum nitride NEMS resonant infrared detector

et al. 2016

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The use of micro-/nanoelectromechanical resonators for the room temperature detection of electromagnetic radiation at infrared frequencies has recently been investigated, showing thermal detection capabilities that could potentially outperform conventional microbolometers. The scaling of the device thickness in the nanometer range and the achievement of high infrared absorption in such a subwavelength thickness, without sacrificing the electromechanical performance, are the two key challenges for the implementation of fast, high-resolution micro-/nanoelectromechanical resonant infrared detectors. In this paper, we show that by using a virtually massless, high-electrical-conductivity, and transparent graphene electrode, floating at the van der Waals separation of a few angstroms from a piezoelectric aluminum nitride nanoplate, it is possible to implement ultrathin (460 nm) piezoelectric nanomechanical resonant structures with improved electromechanical performance (450% improved frequency × quality factor) and infrared detection capabilities (4100 × improved infrared absorptance) compared with metal-electrode counterparts, despite their reduced volumes. The intrinsic infrared absorption capabilities of a submicron thin graphene-aluminum nitride plate backed with a metal electrode are investigated for the first time and exploited for the first experimental demonstration of a piezoelectric nanoelectromechanical resonant thermal detector with enhanced infrared absorptance in a reduced volume. Moreover, the combination of electromagnetic and piezoelectric resonances provided by the same graphene-aluminum nitride-metal stack allows the proposed device to selectively detect short-wavelength infrared radiation (by tailoring the thickness of aluminum nitride) with unprecedented electromechanical performance and thermal capabilities. These attributes potentially lead to the development of uncooled infrared detectors suitable for the implementation of high performance, miniaturized and power-efficient multispectral infrared imaging systems.

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Section: Introductionmentioning

confidence: 99%

Graphene–aluminum nitride NEMS resonant infrared detector

et al. 2016

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“…Furthermore, by using vapors with IR absorbance at specific wavelength regions, wavelength selective IR detection is also demonstrated in this work (Figure b). Most current approaches rely on the use of spectral selective IR filters or IR absorbers, for example, materials with periodic plasmonic structures or photonic structures, to achieve wavelength selective IR detection. For these approaches, the wavelength selectivity is defined by specific structures, which lacks the flexibility in multi‐wavelength detection.…”

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confidence: 99%

Butterfly Wing Inspired High Performance Infrared Detection with Spectral Selectivity

Shen

Luo

et al. 2020

Advanced Optical Materials

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This work explores an alternative infrared (IR) detection mechanism that is based on the desorption of vapor molecules from the Morpho butterfly nanostructures under the stimulation of incoming IR photons, and demonstrates the use of such stimulated desorption for both broadband and wavelength selective IR detection. Compared to the structural deformation‐based IR detection using the Morpho nanostructures, this detection mechanism enables more than an order of magnitude of improvement in both the response of relative reflectance and also the signal‐to‐noise ratio at the maximum heat‐sink‐free response speed. The stimulated desorption also provides the opportunity to achieve the wavelength selective IR detection due to the wavelength selective IR absorption of the adsorbed molecules. With the demonstrated high performance in both broadband and wavelength selective IR detection, this detection approach can potentially enable other high performance sensing systems, including chemical vapor, biological, energy, and environmental sensing systems.

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“…Compared to the above-mentioned 3D packaging structure based on TSVs, the 3D packaging structure with silicon feedthroughs has many outstanding advantages such as lower cost, higher reliability, and a simpler fabrication process. However, its electrical transmission and thermal stress need to be studied systemically for the applications of RF MEMS infrared detectors.High long-wave infrared (LWIR) absorption is necessary for RF MEMS infrared detectors, which contributes to the detectors being capable of detecting weak signals and a high detection accuracy [1,2,16]. For the encapsulation of RF MEMS infrared detectors, an appropriate infrared transmission with a high optical transmission and optical filtering at the LWIR region is highly desirable to improve LWIR absorption and avoid interferences from other IR regions.…”

mentioning

confidence: 99%

“…High long-wave infrared (LWIR) absorption is necessary for RF MEMS infrared detectors, which contributes to the detectors being capable of detecting weak signals and a high detection accuracy [1,2,16]. For the encapsulation of RF MEMS infrared detectors, an appropriate infrared transmission with a high optical transmission and optical filtering at the LWIR region is highly desirable to improve LWIR absorption and avoid interferences from other IR regions.…”

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confidence: 99%

A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors

Zhao

Song

et al. 2019

Electronics

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A novel wafer-level three-dimensional (3D) encapsulation structure was designed for radio-frequency microelectromechanical system (RF MEMS) infrared detectors and investigated by using the finite element method (FEM) simulation. A subwavelength structure with a circular array of coaxial apertures was designed to obtain an extraordinary optical transmission (EOT) on top of a silicon substrate. For perpendicular incident light, a maximum transmission of 56% can be achieved in the long-wave infrared (LWIR) region and the transmission bandwidth covered almost the full LWIR region. Moreover, the maximum transmission could be further promoted with an increase in the incident angle. The vertical silicon vias, insulated by inserted Pyrex glass, were used to generate electrical contacts. With the optimized structure parameters, a feed-through level lower than −82 dB, and a transmission coefficient of one single via of more than −0.032 dB were obtained at a frequency from 0 to 2 GHz, which contributed to the low-loss transmission of the RF signals. Due to the matched thermal expansion coefficients (TECs) between silicon and Pyrex glass, the proposed via structure has excellent thermal reliability. Moreover, its thermal stress is much less than that of a conventional through-silicon via (TSV) structure. These calculated results demonstrate that the proposed 3D encapsulation structure shows enormous potential in RF MEMS infrared detector applications.Electronics 2019, 8, 974 2 of 12 planar interconnect packaging [6][7][8][9][10][11]. There are two primary types of wafer-level 3D packaging. One is film encapsulation, which utilizes an epitaxial highly doped silicon film to seal devices and vertical silicon feedthroughs to transmit electrical signals [6,7]. Although the film encapsulation can contribute to the miniaturization of devices, its micro-fabrication process is very complicated. Another type is typically based on through-silicon vias (TSVs) and wafer-level bonding [8][9][10][11]. This technique utilizes TSVs to make vertical interconnections, which embed the vertical metal feedthroughs and SiO 2 films in bulk silicon to transmit electrical signals and act as the insulation, respectively. However, this technique has some shortcomings including mismatched thermal expansion coefficients (TECs) between the metal and silicon, large dielectric loss, insulation failure, a complex process, and high cost [9]. In addition, the wafer-level bonding between the cap and device wafers is critical to achieve long-term operation as well as high thermal insulation for RF MEMS infrared detectors. The common bonding methods such as Cu-Sn bonding and Au-Sn bonding [11,12] are not cost-effective and easily cause large residue stress in the systems. The silicon wafer with inserted Pyrex glass is a promising 3D packaging structure, which utilizes vertical silicon feedthroughs to transmit electrical signals [13][14][15]. The inserted Pyrex glass acts as the electrical insulation and the anodic bonding material, which also has a matched TEC wi...

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Plasmonic piezoelectric nanomechanical resonator for spectrally selective infrared sensing

Cited by 160 publications

References 45 publications

Graphene–aluminum nitride NEMS resonant infrared detector

Graphene–aluminum nitride NEMS resonant infrared detector

Butterfly Wing Inspired High Performance Infrared Detection with Spectral Selectivity

A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors

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