2021
DOI: 10.1364/ome.430547
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Plasmonics–mine the gap: opinion

Abstract: Gap plasmon structures could enable future ultrafast communication by allowing simultaneous nanoscale integration of electromagnetic waves, nonlinear and optical-electrical conversion, and providing a critical element often overlooked in this context: electrical contacts. Here, the fundamental limit of these structures is discussed, and it is argued that the conventional concept of “smaller is better" for higher confinement is not true when the loss is considered, but few nanometer gaps will be required to giv… Show more

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Cited by 6 publications
(4 citation statements)
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“…Comparison of various EO device technologies is extensively reviewed in the literature. ,, ,,,,,,, Meaningful comparison of different technologies is complex and can be misleading. Some general comments can be made.…”
Section: Role Of Device Architecture On Device Performancementioning
confidence: 99%
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“…Comparison of various EO device technologies is extensively reviewed in the literature. ,, ,,,,,,, Meaningful comparison of different technologies is complex and can be misleading. Some general comments can be made.…”
Section: Role Of Device Architecture On Device Performancementioning
confidence: 99%
“…A sea change in electro-optic technology (and ultimately, optical rectification technology) has occurred with (1) the advent of the subwavelength technologies of silicon photonics and plasmonics , and with (2) theory-guided improvement of the r 33 values and other relevant properties of OEO materials. ,, Silicon photonics and plasmonics have facilitated a dramatic reduction in device dimensions. Plasmonic–organic hybrid (POH) device lengths can be reduced to less than 10 μm and electrode spacings to less than 50 nm (nm).…”
Section: Introductionmentioning
confidence: 99%
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“…They allow electrical bias fields and optical modes in the same region, which favors integration with existing electronics [20]. The two metal layers provide electrical contacts down to the nanometer scale [21,22], while their high thermal conductivity facilitates heat removal from the circuitry [13,23,24]. They merge the subwavelength operation of electronics with the large bandwidth of photonics, promising a new generation of faster ultra-compact photonic integrated circuits [4,11,[25][26][27][28][29].…”
Section: Introductionmentioning
confidence: 99%