An oxygen free high conductivity (OFHC) copper was subjected to maximum 13 ECAP passes to achieve a sufficiently high degree of deformation. Strength properties (yield stress and ultimate tensile strength) show obvious increase up to the 4 th pass. In the 6 th ECAP pass, the yield stress and ultimate tensile strength are stabilized at a maximum of 449 MPa. Microstructure studies showed that the 1 st ECAP pass caused a significant increase of dislocation density. These dislocations are arranged in cells, forming dense dislocation walls at low-angle subgrains. After the 5 th ECAP pass, well-defined equiaxed ultrafine grains of diameter approximately 500 nm had emerged forming high-angle grain boundaries. The defect density studies carried out by positron annihilation spectroscopy method revealed an increase in a defect density (vacancies, dislocations) up to the 4 th pass, consequently with number of ECAP passes increasing, decrease in defects density (seen by positrons) was observed.K e y w o r d s : dislocation, grain boundaries, equiaxed ultrafine grained microstructure, electron microscopy, Equal Channel Angular Pressing (ECAP)