2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) 2015
DOI: 10.1109/prime.2015.7251369
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Platform based design of 3D Hall sensor conditioning electronics

Abstract: In this paper the modeling activity for the realization of a general architecture suitable to interface a heterogeneous set of magnetic sensors for automotive applications is presented. This work represents the first step of a 'platform based' approach that aims at improving system performance while minimizing time-to-market. In particular, a case study is shown in which 3D Hall sensors have been used; these sensors allow 2D and 3D magnetic field measurements in Cartesian or polar coordinates, position measure… Show more

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Cited by 2 publications
(2 citation statements)
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“…Particularly, the SENSASIP chip is used to implement the algorithms in [3,[19][20][21] in real time for the sensor signal processing of a 3D Hall sensor and of an inductive position sensor in X-by-wire automotive applications. In these specific applications, the real-time application requirements were met already with a clock frequency for SENSASIP of 8 MHz.…”
Section: Vlsi Implementation and Characterizationmentioning
confidence: 99%
“…Particularly, the SENSASIP chip is used to implement the algorithms in [3,[19][20][21] in real time for the sensor signal processing of a 3D Hall sensor and of an inductive position sensor in X-by-wire automotive applications. In these specific applications, the real-time application requirements were met already with a clock frequency for SENSASIP of 8 MHz.…”
Section: Vlsi Implementation and Characterizationmentioning
confidence: 99%
“…The emerging features growth is leading to new design strategies (e.g. [2,3,4]), and to novel design tools ( [5]). The trend is to move the design effort to higher level.…”
Section: Introductionmentioning
confidence: 99%