Plating of Indium-Tin Alloy

Ota, Juro; Ishikawa, Tsuyoshi; Kosakai, Kaoru

doi:10.4139/sfj1950.16.246

Cited by 2 publications

(1 citation statement)

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“…The electrodeposition of Sn-In alloys in aqueous solutions usually involves either strongly acidic or alkaline electrolytes, both containing alkali metal salts of carboxylic acids as chelating agents to ease the Sn deposition. A better stability and control of the plating process has been noticed in the case of alkaline baths [21]. Acidic sulfate based electrolytes have been also applied to electrodeposit Sn-In alloys, usually in the presence of several organic additives to facilitate obtaining bright coatings.…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents

Anicăi

Petica

Costovici³

et al. 2019

Coatings

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Tin–indium alloys represent attractive lead-free solder candidates. They show lower values of melting point than pure indium, so that they are investigated as materials with significant applications potential in the electronic industry. Electrodeposition is a very convenient route to prepare Sn–In alloys. The paper presents several experimental results regarding the electrodeposition of Sn–In alloy coatings involving deep eutectic solvents (DESs), namely using choline chloride-ethylene glycol eutectic mixtures. The influence of the main operating parameters on the Sn–In alloy composition and characteristics are presented. Adherent and uniform Sn–In alloy deposits containing 10–65 wt % In have been obtained on Cu substrates. The In content was found to increase as both the In:Sn molar concentration ratio of ionic species in the electrolyte and the applied temperature increased. The use of pulsed current allowed the use of higher current densities leading to slightly higher values of In content in the alloy deposit. X-ray diffraction (XRD) analysis revealed the presence of InSn4 and In3Sn phases in agreement with the phase diagram. According to thermogravimetric analysis (TGA) measurements, values of melting points in the range of 118.6 and 127.5 °C were obtained depending on the alloy composition. The solder joints’ behavior and alloy coatings corrosion performance were also discussed.

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Section: Introductionmentioning

confidence: 99%