Platinum thin film resistors with Cr under- and overlayers for Nb/Al2O3/Nb technology

Dolata, R.; Balashov, D

doi:10.1016/s0921-4534(97)01800-5

Cited by 5 publications

(2 citation statements)

References 6 publications

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“…In order to connect the groundplane to other metal layers, holes are etched into the double dielectric layer in a CHF 3 -O 2 RIE process. The next step (not included in figure 1) is the deposition of a Cr/Pt/Cr layer which is etched by Ar milling to form bias resistors [8]. After this, the Nb/Al x O y /Al/Al x O y /Nb multilayer is deposited and covered with a thin SiO 2 layer which serves as a mask during anodization and eliminates the undercut of simple photoresist masks (figures 1(c) and 1(d)).…”

Section: Fabrication Processmentioning

confidence: 99%

SINIS fabrication process for realizing integrated circuits in RSFQ impulse logic

Balashov

Khabipov

Buchholz

et al. 1999

Supercond. Sci. Technol.

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At PTB, a new type of fabrication process has been developed to verify rapid single flux quantum (RSFQ) integrated circuits based on intrinsically shunted two-tunnel Josephson junctions (JJs). The process has been realized in LTS implementation using SINIS technology. A variety of single JJs, junction arrays and test circuits have been fabricated and experimentally investigated. The critical current densities of the junctions were set to a nominal value of j C = 500 A cm −2 , with values of the characteristic voltage V C equal to or larger than 160 µV. The JJs show nearly hysteresis-free behaviour (less than 10%); the intrawafer parameter spread is smaller than ±10%. Various basic RSFQ circuits have been realized with operation margins of bias currents of larger than ±20%.

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Section: Fabrication Processmentioning

confidence: 99%

SINIS fabrication process for realizing integrated circuits in RSFQ impulse logic

Balashov

Khabipov

Buchholz

et al. 1999

Supercond. Sci. Technol.

Self Cite

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show abstract

“…It was also found that platinum would not adhere to low-stress Si 3 N 4 , without using an adhesion layer. Chromium was used because of its excellent adhesive properties with respect to platinum [103].…”

Section: Platinum Resistor Metallizationmentioning

confidence: 99%

Bulk-micromachined mass airflow sensor fabrication and testing methodology for an undergraduate microfabrication course.

Colé¹,

Jason²

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RSFQ circuitry realized in a SINIS technology process

Khabipov

Balashov

Buchholz

et al. 1999

IEEE Trans. Appl. Supercond.

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Platinum thin film resistors with Cr under- and overlayers for Nb/Al2O3/Nb technology

Cited by 5 publications

References 6 publications

SINIS fabrication process for realizing integrated circuits in RSFQ impulse logic

SINIS fabrication process for realizing integrated circuits in RSFQ impulse logic

Bulk-micromachined mass airflow sensor fabrication and testing methodology for an undergraduate microfabrication course.

RSFQ circuitry realized in a SINIS technology process

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