Highly
conductive domain walls in insulating ferroelectric LiNbO3 (LNO) single-crystal thin films with atomic smoothness are
attractive for use in high-density integration of the ferroelectric
domain wall random access memory (DWRAM) because of their excellent
reliability and high read currents. However, downscaling of the memory
size to the nanoscale could cause poor polarization retention. Understanding
the size-dependent electrical performance of a memory cell is therefore
crucial. In this work, highly insulating X-cut LNO thin films were
bonded to SiO2/Si wafers and lateral mesa-like cells were
fabricated on the film surfaces, where contact occurred with two-sided
electrodes along the polar z-axis. Under application
of an in-plane electric field above a coercive field (E
c), the domain within each memory cell was switched to
be antiparallel to the unswitched referencing domain at the bottom;
this resulted in the formation of a conducting domain wall, which
enables the nondestructive readout strategy of the DWRAM. The cell,
which has a lateral length (l) above a critical size
(l
0) of 105 nm, is found to be a mixture
of two phases across the cell area. The inner area of the cell suffers
from poor polarization retention because E
c = 150 kV/cm, as demonstrated by in-plane piezoresponse force microscopy
imaging. In comparison, the outer periphery domains, which have lengths
of 70 nm (∼l
0/2), show good retention
but require a much higher E
c of 785 kV/cm.
The relevant physics is discussed as phase reconstruction occurs after
release of the in-plane compressive strain near the outer regions;
the results show good agreement with those of one-dimensional thermodynamic
calculations and phase-field simulations. The measured current–voltage
curves demonstrated a sudden enhancement of the wall current across
the cell when l < l
0, thus implying higher readout wall currents and better retention
for the DWRAM at higher storage densities.