Polishing and planarization of single crystal diamonds: state-of-the-art and perspectives

Abstract

Diamond is a promising material for the modern industry. It is widely used in different applications, such as cutting tools, optical windows, heat dissipation, and semiconductors. However, these application areas require exceptionally flattened and polished diamond surfaces. Unfortunately, due to the extreme hardness and chemical inertness of diamond, the polishing of diamond is challenging. Since the 1920s, various conventional and modern mechanical, chemical, and thermal polishing techniques have been proposed and developed for finishing diamond surfaces. Therefore, to impart proper guidance on selecting a good polishing technique for production practice, this paper presents an in-depth and informative literature survey of the current research and engineering developments regarding diamond polishing. At first, a brief review of the general developments and basic material removal principles is discussed. This review concludes with a detailed analysis of each techniques’ polishing performance and critical challenges, and a discussion of the new insights and future applications of diamond polishing.

A Review on Precision Polishing Technology of Single-Crystal SiC

“…CMP, also known as thermal oxidation polishing, utilizes MP in conjunction with chemicals to enhance the MRR and improve surface quality [20]. Figure 2 illustrates the schematic of a typical CMP process [21].…”

“…The main factors affecting the MRR and surface roughness of CMP are the pH of slurry, abrasive, oxidant, catalyst, and so forth. CMP, also known as thermal oxidation polishing, utilizes MP in con chemicals to enhance the MRR and improve surface quality [20]. Figure 2 schematic of a typical CMP process [21].…”

“…After decades of research, the family of typically used oxidants expanded to include dozens of members (e.g., NaClO, H 2 O 2 , KOH, and KMnO 4 ). In practice, the oxidants and polishing powder are usually mixed in the slurry to obtain a high removal rate [20]. The commonly used polishing powders include colloidal silica, CeO 2 , nanodiamond, and Al 2 O 3 .…”

“…The high MRR of SiC in the low stressed areas effectively reduced the depth of scratches. removal rate [20]. The commonly used polishing powders include colloidal silica, CeO2, nanodiamond, and Al2O3.…”

Синтез CVD-алмаза Детекторного Качества Для Радиационно-Стойких Детекторов Ионизирующего Излучения

“…Возможно, это зависит от режима полировки. При аккуратной полировке в мягком направлении в приповерхностном слое происходит только пластическое течение материала, наоборот, при обработке с хрупким удалением материала генерируются дефекты, в том числе такие точечные дефекты, как вакансии, способные в реакции с N s образовывать NV-дефекты [38].…”