Polishing behaviors of ceria abrasives on silicon dioxide and silicon nitride CMP

Oh, Min‐Cheol; Nho, Jun-Seok; Cho, Seung-Beom; Lee, Jae-Seok; Singh, Rajiv K.

doi:10.1016/j.powtec.2010.09.025

Cited by 65 publications

(23 citation statements)

References 16 publications

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“…In the last few years, cerium oxide (ceria) nanoparticles have extensively been studied due to their potential uses in various applications in different fields, such as UV absorbents and filters (Tsunekawa et al 2000), polishing media in micro-electronics, luminescent materials (Oh et al 2011), neuroprotective agents in biological systems (Das et al 2007), and as catalysts in the fuel cell technology (Steel and Heinzel 2001). Oxides with the cubic fluorite structure like ceria are known to be excellent solid electrolytes when they are doped with certain cations due to the reduction of the energy barrier for oxygen migration and the improvement of the ionic conductivity (Andersson et al 2006).…”

Section: Introductionmentioning

confidence: 99%

Control of oxygen vacancies and Ce+3 concentrations in doped ceria nanoparticles via the selection of lanthanide element

et al. 2012

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The effect of lanthanides that have positive association energies with oxygen vacancies, such as samarium and neodymium, and the elements with negative association energies, such as holmium and erbium, on ionization state of cerium and, consequentially, the oxygen vacancy concentration in doped ceria nanoparticles are investigated in this article. Structural and optical characterizations of the doped and undoped ceria nanoparticles, synthesized using chemical precipitation, are carried out using transmission electron microscopy, X-ray diffractometry, optical absorption spectroscopy, and fluorescence spectroscopy. It is deduced that the negative association energy dopants decrease the conversion of Ce ?4 into Ce ?3 and, hence, scavenge the oxygen vacancies, evidenced by the observed increase in the allowed direct bandgap, decrease in the integrated fluorescence intensity, and increased the size of doped nanoparticles. The opposite trends are obtained when the positive association dopants are used. It is concluded that the determining factor as to whether a lanthanide dopant in ceria acts as a generator or scavenger of oxygen vacancies in ceria nanoparticles is the sign of the association energy between the element and the oxygen vacancies. The ability to tailor the ionization state of cerium and the oxygen vacancy concentration in ceria has applications in a broad range of fields, which include catalysis, biomedicine, electronics, and environmental sensing.

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Section: Introductionmentioning

confidence: 99%

Control of oxygen vacancies and Ce+3 concentrations in doped ceria nanoparticles via the selection of lanthanide element

et al. 2012

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“…(2), (5), (6), (10), (11), (12), and (14) into the Eq. (13), the relation between the penetration depth of a particle inside fused silica and the polishing parameters can be described by the following equation:…”

Section: Indentation Depth Of a Nanoparticle Inside Fused Silicamentioning

confidence: 99%

“…But hard particles were used in all these models of the CMP processes; such processes were easy to leave scratches and other damage on the polished fused silica surface. Investigations [10][11][12] have proved that ceria nanoparticles and other soft particles are more beneficial to improving the polishing quality of fused silica, and the classic plastic contact theory and cutting theory fail to explain the material removal mechanism on CMP process for fused silica using soft polishing particles. This paper presents a mathematical material removal model based on the chemical and mechanical synergistic effects in the fused glass CMP process using soft polishing particles.…”

Section: Introductionmentioning

confidence: 99%

Material removal model of chemical mechanical polishing for fused silica using soft nanoparticles

Liu

Chen

2016

Int J Adv Manuf Technol

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Fiber arrays are used to connect arrayed waveguide chips. The end-faces of fiber array components are multimaterials non-uniform surfaces. Their low polishing quality has become a bottleneck that restricts coupling performance of integrated photo-electronic devices. The chemical mechanical polishing (CMP) is normally used to improve the polishing quality of the end-faces of fiber array components. It is very important to optimize process parameters by researching the mechanical behavior of nanoparticles and material microstructure evolution on the CMP interfaces. Based on the elastic and hyper-elastic contact of the soft polishing nanoparticles with fused silica and polishing pad, respectively, the material removal mechanism at molecular scale of polishing process for fused silica using nanoparticles is investigated, and the material removal rate model is also derived by using Arrhenius theory and molecule vibration theory. Theoretical and experimental results show that the material is mainly removed by the interfacial tribo-chemical effect between polishing nanoparticles and fused silica during CMP process. The penetration depth of a single nanoparticle inside the fused silica is at molecular scale, and the superficial molecules of fused silica are removed by chemical reactions because of enough energy obtained. The material removal rate of fused silica during CMP process is determined by the polishing pressure, the chemical reagents and its concentration, and the relative movement speed between the fused silica workpiece and the polishing pad.

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“…6 The nature of nanoceria influences its properties, and therefore, synthetic routes have been devised to control the size, shape, and microstructure of ceria nanomaterials: techniques such as hydrothermal 7 and solvothermal 8 crystallization, precipitation, 9 and liquid phase spray pyrolysis 10 are used to selectively synthesize ceria nanoparticles with cuboidal, 11 polyhedral 12 and spherical morphologies, 10 ceria nanorods 13 and nanotubes, 14 and nanoceria with three-dimensional mesoporous architectures. 15 Central to the wide variety of applications of ceria is the ability of the material to store and release oxygen.…”

Section: ■ Introductionmentioning

confidence: 99%

Tuning the Properties of Nanoceria by Applying Force: Stress-Induced Ostwald Ripening

2016

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The ionic conductivity and activity of a material, such as ceria, is central to its exploitation in applications such as fuel cells or catalysis. Grain boundaries (GB) influence profoundly the ionic conductivity and activity of a material. Accordingly, the ability to control GB concentrations is pivotal to these applications. Here, we show that Oswald ripening can be induced by applying uniaxial force. In particular, grain boundaries are purged to facilitate single nanocrystals from polycrystalline precursors. Our simulations thus predict mechanisms for straintunable properties.

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Polishing behaviors of ceria abrasives on silicon dioxide and silicon nitride CMP

Cited by 65 publications

References 16 publications

Control of oxygen vacancies and Ce+3 concentrations in doped ceria nanoparticles via the selection of lanthanide element

Control of oxygen vacancies and Ce+3 concentrations in doped ceria nanoparticles via the selection of lanthanide element

Material removal model of chemical mechanical polishing for fused silica using soft nanoparticles

Tuning the Properties of Nanoceria by Applying Force: Stress-Induced Ostwald Ripening

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