2007
DOI: 10.1016/j.ijmachtools.2006.11.003
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Polishing of polycrystalline diamond by the technique of dynamic friction. Part 2: Material removal mechanism

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Cited by 83 publications
(33 citation statements)
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“…Raman spectroscopy can be used to distinguish different forms of carbon [26,27]. The Raman spectra of the central position of UHPCD and PCD are shown in Fig.…”
Section: Characterizationsmentioning
confidence: 99%
“…Raman spectroscopy can be used to distinguish different forms of carbon [26,27]. The Raman spectra of the central position of UHPCD and PCD are shown in Fig.…”
Section: Characterizationsmentioning
confidence: 99%
“…Such differential thermal expansion is known to occur at temperatures of about 400°C, causing ruptures to occur in the diamond-to-diamond bonding, and resulting in the formation of cracks and chips in the PCD structure. Chipping and micro-cracking of cutting edges occur as a result [41][42][43].…”
Section: Thermal Stability As the Weakest Link Of Conventional Pcdsmentioning
confidence: 99%
“…Dynamic friction polishing (DFP) technology [10] is an abrasive-free process which utilizes the thermochemical reaction induced by frictional heating between diamond and catalytic metal plate rotating at a high peripheral speed (15-25 m=s) to polish single and polycrystalline diamond. DFP technology has the advantages of high material removal rate and simple experimental equipment.…”
Section: Please Scroll Down For Articlementioning
confidence: 99%