“…It is commonly known that, as a result of sample grinding and polishing during the treatment, numerous extended micro defects, such as, e.g., micro scratches, micro cracks, micro voids, digs or pits, etc. [57], are generated in the near-surface layers that form a damaged layer [58], which can be quite thick (it penetrates to the depth of tens micrometers in some materials [59]). Besides, additional non-uniformly distributed internal stress is introduced by this processing into the near-surface 10 Note that the characteristic dimensions a of the light scatterers (they were estimated as a 150 nm in Ref.…”