Poly-Si thickness and temperature dependent oxide disruption induced by penetration of the interfacial oxide in (p) poly-Si/SiOx passivating contacts

Linke, Jonathan; Glatthaar, Raphael; Huster, Frank; Okker, Tobias; Möller, S.; Hahn, Giso; Terheiden, Barbara

doi:10.1016/j.solmat.2022.111890

Cited by 3 publications

(1 citation statement)

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“…The results show that the thermal stress caused by the CTE mismatch of different interface materials is the main reason ( Figure 8 ). Additionally, the generated cyclic thermal stress may cause the metal layer with weak adhesion on the chip surface to slip during thermal cycling, resulting in a metal-layer short or open circuit failure; it may also lead to the rupture of the passivation layer or polycrystalline silicon layer, as shown in Figure 9 , resulting in the short circuit between the multilayered metallization layers [ 65 ]. In addition, RDL delamination, an important component of advanced packaging under heterogeneous integration, also frequently occurs after temperature cycling tests, where fatigue stress at the material interface leads to cracking due to repeated thermal expansion and contraction of different material layers in the RDL.…”

Section: Delamination Mechanism At the Two-phase Interfacementioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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Section: Delamination Mechanism At the Two-phase Interfacementioning

confidence: 99%