“…Therefore, the radiators are essential for electronic components, and thermal interface materials (TIMs) are also needed between electronic components and heat sinks to improve the heat dissipation efficiency. [1][2][3][4] TIMs usually consist of polymer and inorganic fillers such as metal materials (e.g., silver nanoparticles [5,6] ), ceramic materials (e.g., aluminum oxide [7,8] , zinc oxide, [9,10] titanium oxide, [11] boron nitride, [12][13][14] aluminum nitride, [15,16] and silicon nitride [17] ), and carbon-based materials (e.g., carbonnanotubes, [18,19] graphene, [20,21] and carbon fiber [22] ). Hexagonal boron nitride (hBN) has been considered as a promising candidate used in TIMs owing to its high thermal conductivity and excellent electrical insulation.…”