2023
DOI: 10.1016/j.mtcomm.2023.106860
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Polyacrylonitrile/N-doped graphene quantum dots nanocomposite activity as SERS nanosensors for detection of methylene blue

Saloni Sharma,
Rajesh Kumar,
Ram Manohar Yadav
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Cited by 10 publications
(3 citation statements)
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“…The PL mechanism of GQDs involves the QDs regulated by the number of aromatic rings and surface-related states associated with charge transfer occurring between the sp 2 carbon network and surface states. Factors such as preparation methods, size and shape, doping heteroatoms, and passivation influence the PLQY, emission, stability, and PL lifetime of GQDs [130][131][132].…”
Section: Carbon-based Qdsmentioning
confidence: 99%
“…The PL mechanism of GQDs involves the QDs regulated by the number of aromatic rings and surface-related states associated with charge transfer occurring between the sp 2 carbon network and surface states. Factors such as preparation methods, size and shape, doping heteroatoms, and passivation influence the PLQY, emission, stability, and PL lifetime of GQDs [130][131][132].…”
Section: Carbon-based Qdsmentioning
confidence: 99%
“…45 Polyacrylonitrile (PAN) has good mechanical qualities, chemical stability, and processability, which make it suitable for SERS applications as a base material. [46][47][48][49][50][51][52] Using PAN as the composite matrix allows for the immobilisation of metal particles while preserving and even enhancing their strength and SERS performance. In addition, PAN lms have a tendency to be porous due to their structure during deposition.…”
Section: Introductionmentioning
confidence: 99%
“…Polymer-based composites have been extensively explored for this purpose. However, enhancing the low thermal conductivity of polymers necessitates incorporating fillers with high thermal or electrical conductivity, including boron nitride (BN), aluminum nitride (AlN), Al 2 O 3 , graphene oxide (GO), and carbon nanotubes (CNTs). Although these fillers improve the thermal or electrical conductivity, achieving both high EMI SE and the electrical insulation required by electronic packing materials remains difficult. To address this problem, we utilized magnetic particle fillers, , specifically Fe 3 O 4 and MgO nanoparticles.…”
Section: Introductionmentioning
confidence: 99%