2022
DOI: 10.1016/j.polymer.2022.125424
|View full text |Cite
|
Sign up to set email alerts
|

Polybenzoxazine Aerogels for Thermal Protection at Extremely High-Temperature/Cryogenic Conditions

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3

Citation Types

0
3
0

Year Published

2023
2023
2025
2025

Publication Types

Select...
6

Relationship

1
5

Authors

Journals

citations
Cited by 14 publications
(3 citation statements)
references
References 29 publications
0
3
0
Order By: Relevance
“…Aerogels are a class of nanoporous solids with low density, high porosities, and high specific surface area . Aerogels have been used in aerospace and electronic applications because of their excellent thermal-insulation performance. Silica aerogels have been studied most extensively because they exhibit the lowest thermal conductivity among all aerogels; however, their inherent properties including brittleness and hydroscopicity limit their application in aerospace thermal protection. , Some attempts have been made to enhance the compressive strength of silica aerogels such as by reinforcing the silica backbone with a conformal polymer coating .…”
Section: Introductionmentioning
confidence: 99%
“…Aerogels are a class of nanoporous solids with low density, high porosities, and high specific surface area . Aerogels have been used in aerospace and electronic applications because of their excellent thermal-insulation performance. Silica aerogels have been studied most extensively because they exhibit the lowest thermal conductivity among all aerogels; however, their inherent properties including brittleness and hydroscopicity limit their application in aerospace thermal protection. , Some attempts have been made to enhance the compressive strength of silica aerogels such as by reinforcing the silica backbone with a conformal polymer coating .…”
Section: Introductionmentioning
confidence: 99%
“…However, to be used as electronic materials, the relatively high polarity, high water uptake, low thermal resistance, and high dielectric constant is not ideal 28 . Consequently, the epoxy resin based electronic materials are usually considered as low end product 29 . It is well known that epoxy resins cannot be cured without curing agents, 30 and the properties of the final cured resins are highly dependent on the curing agents.…”
Section: Introductionmentioning
confidence: 99%
“…28 Consequently, the epoxy resin based electronic materials are usually considered as low end product. 29 It is well known that epoxy resins cannot be cured without curing agents, 30 and the properties of the final cured resins are highly dependent on the curing agents. Importantly, the active functional species such as phenolic hydroxyls and amino groups could play as curing agents for epoxy resins and copolymerization between benzoxazine and epoxy resin could be achieved.…”
Section: Introductionmentioning
confidence: 99%