Polydopamine-assisted silver-coated spherical boron nitride as dual functional filler for thermal management and electromagnetic interference shielding

Ran, Shusen; Xie, Jian; Li, Chenjian; Qin, Hongmei; Chen, Zhimin; Wang, Xuelin; Yu, Yueliang; Wang, Shan; Xiong, Chuanxi

doi:10.1016/j.diamond.2023.109856

Cited by 8 publications

(1 citation statement)

References 47 publications

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“…After 10 cycles, the nanocomposite still maintains a stable thermal conductivity at 25 and 100 °C, indicating that it has excellent thermocycling stability. Figure f shows the comparison of the thermal conductivity of PANF-BNNS/EP with other previous studies. − Figure S15 and Table S4 display the comparison of specific values. Our material shows huge advantages in the view of filling contents.…”

Section: Resultsmentioning

confidence: 86%

Self-Stacked 3D Anisotropic BNNS Network Guided by Para-Aramid Nanofibers for Highly Thermal Conductive Dielectric Nanocomposites

Miao

Xie

et al. 2023

ACS Appl. Mater. Interfaces

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The enhancement of the heat-dissipation property of polymerbased composites is of great practical interest in modern electronics. Recently, the construction of a three-dimensional (3D) thermal pathway network structure for composites has become an attractive way. However, for most reported high thermal conductive composites, excellent properties are achieved at a high filler loading and the building of a 3D network structure usually requires complex steps, which greatly restrict the large-scale preparation and application of high thermal conductive polymer-based materials. Herein, utilizing the framework-forming characteristic of polymerization-induced para-aramid nanofibers (PANF) and the high thermal conductivity of hexagonal boron nitride nanosheets (BNNS), a 3D-laminated PANF-supported BNNS aerogel was successfully prepared via a simple vacuum-assisted self-stacking method, which could be used as a thermal conductive skeleton for epoxy resin (EP). The obtained PANF-BNNS/EP nanocomposite exhibits a high thermal conductivity of 3.66 W m −1 K −1 at only 13.2 vol % BNNS loading. The effectiveness of the heat conduction path was proved by finite element analysis. The PANF-BNNS/EP nanocomposite shows outstanding practical thermal management capability, excellent thermal stability, low dielectric constant, and dielectric loss, making it a reliable material for electronic packaging applications. This work also offers a potential and promotable strategy for the easy manufacture of 3D anisotropic high-efficiency thermal conductive network structures.

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