Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

Zhang, Yajun; Wang, Jie; Chen, Yinjie

doi:10.1039/d2ra00267a

Cited by 5 publications

(3 citation statements)

References 53 publications

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“…Comparison of the dielectric constant and thermal properties of the composites from the literature and this work. ,− For details and the values included in the plot, see Table S2, Supporting Information.…”

Section: Resultsmentioning

confidence: 99%

Optimization of the Thermally Conductive Low-k Polymer Dielectrics Based on Multisource Free-Volume Effects

Xu,

Wang,

Cao

et al. 2024

ACS Appl. Mater. Interfaces

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Polymers/polymer matrix composites possessing low dielectric constants (low-k polymer dielectrics) contribute to the advance of electronics, for instance, microprocessor chips, mobile phone antennas, and data communication terminals. However, the intrinsic long-chain structural characteristic results in poor thermal conductivities, which draw heat accumulation and undermine the outstanding low-k performance of polymers. Herein, multisource free-volume effects that combine two novel kinds of extra free volume with the known in-cage free volume of polyhedral oligomeric silsesquioxanes (POSSs) are discussed to reduce the capacity for dielectric constant reduction. The multisource free-volume effects of POSSs are associated with the thermal conductive network formed by the hexagonal boron nitride (BN) in the polymer matrix. The results show a decent balance between low-k performance (dielectric constant is 2.08 at 1 MHz and 1.98 at 10 GHz) and thermal conductivity (0.555 W m −1 K −1 , 4.91 times the matrix). The results provide a new idea to maximize the free-volume effects of POSSs to optimize dielectric properties together with other desired performances for the dielectrics.

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Section: Resultsmentioning

confidence: 99%

Optimization of the Thermally Conductive Low-k Polymer Dielectrics Based on Multisource Free-Volume Effects

Xu,

Wang,

Cao

et al. 2024

ACS Appl. Mater. Interfaces

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“…Stress-strain curves of PI films with different factors. (a) thickness, (b) viscosity, (c) substrate, (d) Comparison of the fracture elongation, tensile strength, and thickness of the prepared PI films with those reported in other studies[14,16,[35][36][37][38][39][40][41][42][43][44].…”

mentioning

confidence: 88%

“…As depicted in Figure 5c, the films deposited on Si/SiO 2 substrates exhibited superior toughness compared to those on glass substrates, possibly due to the lower surface roughness of Si/SiO 2 . Figure 5d shows the mechanical properties of PI films prepared in different studies [14,16,[35][36][37][38][39][40][41][42][43][44]. Table 1 shows the structure, thickness, and corresponding mechanical properties of the PI films.…”

Section: Mechanical Propertiesmentioning

confidence: 99%

Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes

Zhao

Dong

et al. 2023

Polymers

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High-quality and free-standing polyimide (PI) film with desirable mechanical properties and uniformity is in high demand due to its widespread applications in highly precise flexible and chip-integrated sensors. In this study, a free-standing PI film with high toughness was successfully prepared using a diamine monomer with ether linkages. The prepared PI films exhibited significantly superior mechanical properties compared to PI films of the same molecular structure, which can be attributed to the systematic exploration of the film-forming process. The exploration of the film-forming process includes the curing procedures, film-forming substrates, and annealing treatments. Additionally, the thickness uniformity and surface homogeneity of free-standing films were crucial for toughness. Increasing the crystallinity of the PI films by eliminating residual stress also contributed to their high strength. The results demonstrate that by adjusting the above-mentioned factors, the prepared PI films possess excellent mechanical properties, with tensile strength and elongation at break of 194.71 MPa and 130.13%, respectively.

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Boron nitride/expanded graphite heterojunction films for the epoxy composites to enhance the heat dissipation capabilities

Wu,

Jia

2024

J of Applied Polymer Sci

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The integration and portable development of electronic devices urgently require flexible films with high thermal conductivity and insulation to overcome heat accumulation. The layered heterojunction composite films are prepared by the stacking technique for the first time. The morphology, structure composition and thermal stability of heterojunction films are studied. Compared with pure epoxy resin (EP), the heterojunction film still has good thermal stability at 600°C. At the same time, the plane heat conduction network constructed by the expanded graphite (EG) plane of the heterojunction film enables the film to dissipate heat effectively. In the simulation process of actual heat dissipation, the chip surface temperature can be reduced by 10°C. The thermal conductivity of the heterojunction film is 2.49 Wm−1 K−1 when the mass fraction of boron nitride‐ γ aminopropyl triethoxysilane (BN‐KH550) is 50 wt%. Compared with pure epoxy resin, the thermal conductivity is increased by 1464%. The boron nitride (BN) surface resistance of the heterojunction film is large, which can isolate the conductive path of the EG layer and provide effective electrical insulation.

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Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

Abstract: A novel high-strength polyimide nanocomposite film was obtained by the copolymerization of epoxidized polyhedral oligomeric silsesquioxane-modified hexagonal boron nitride and polyamic acid.

Cited by 5 publications

References 53 publications

Optimization of the Thermally Conductive Low-k Polymer Dielectrics Based on Multisource Free-Volume Effects

Optimization of the Thermally Conductive Low-k Polymer Dielectrics Based on Multisource Free-Volume Effects

Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes

Boron nitride/expanded graphite heterojunction films for the epoxy composites to enhance the heat dissipation capabilities

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