Polyimide and polyhedral oligomeric silsesquioxane nanocomposites for low-dielectric applications

Lee, Yuan-Jyh; Huang, Jieh-Ming; Kuo, Shiao‐Wei; Lu, Jian-Shing; Chang, Feng‐Chih

doi:10.1016/j.polymer.2004.10.003

Cited by 186 publications

(125 citation statements)

References 20 publications

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“…[42] Many dielectric polyimides have been created, and the original motivation for the development of polyimide dielectrics was as a lowcost alternative to on-chip silicon dioxide with high T g , high modulus, and low dielectric constant as compared with silicon dioxide. [43] The dielectric constants (ɛ r ) of the prepared fluorinated polyimides were determined in the range of 2.60-2.76, as shown in Table 4, which are lower than the non-fluorinated polyimides such as PMDA-ODA (3.16), [44] PI-POSS (2.65-3.22) [45], and PI/PSSQ (2.79-3.61) [46] nanocomposites, but comparable with other fluorinated polyimides. [18,19,23] The high electrical insulating and low dielectric constants of the fluorinated polyimides are mainly attributed to the high fluorine loadings in the polyimide backbones.…”

Section: Dielectric Properties and Water Absorption Of Pieismentioning

confidence: 99%

Organosoluble, thermally stable and low dielectric constant fluorinated polyimides containing 2,4,5-triphenylimidazole moiety in the main chains

Ghaemy

Berenjestanaki

Bazzar

2013

Designed Monomers and Polymers

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A photoactive highly fluorinated diamine was synthesized, characterized, and used in preparation of structurally confirmed poly(imidazole-ether-imide)s (PIEIs). These polymers showed excellent solubility, moderate viscosities, good thermal stability (T g = 230-280°C, T i = 390-435°C, T 10% = 480-510°C), low dielectric constant (2.60-2.76), and water absorptions. The PIEIs films showed highly optical transparency with light transmittance at 550 nm of as high as 80% and cutoff wavelength of as low as 390 nm. These polymers exhibited fluorescence emission peaks around 410-490 nm with the quantum yields measured in solution varied from 12 to 32%.

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Section: Dielectric Properties and Water Absorption Of Pieismentioning

confidence: 99%

Organosoluble, thermally stable and low dielectric constant fluorinated polyimides containing 2,4,5-triphenylimidazole moiety in the main chains

Ghaemy

Berenjestanaki

Bazzar

2013

Designed Monomers and Polymers

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“…As an alternative, waterborne porous PI has been prepared via condensation of water vapor onto a PI solution spun on a substrate [2], with micron-sized condensed water droplets acting as a porogen. This method allows the dielectric constant of porous films to be further reduced to 1.7, although a 48-h time period was required for water droplets to form in these porous films, with other porogens also extensively studied [12][13][14][15][16][17][18][19][20][21][22][23].…”

Section: Introductionmentioning

confidence: 99%

Controlling the Pore Structure of Polyimide Films Prepared by Exposure to High-Pressure CO<sub>2</sub> and UV Light

Taki

Isawa

Mizoguchi

2017

J. Photopol. Sci. Technol.

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Porous polyimide is a promising low-permittivity material for reducing the attenuation of high-frequency signals. Previously, the suitability of porous polyimide films for flexible printed circuits was tested by subjecting them to cover-layering and copper plating. These treatments resulted in pore collapse and infiltration, respectively, indicating the necessity of using closed-pore films. Herein, closed-pore porous polyimide films were prepared at various CO 2 gas pressures, tertiary amine methacrylate monomer concentrations, and pre-baking times, revealing the key role of pre-baking time in maximizing porosity while preserving closed pores. In contrast to our previous study, the formation of closed pores was explained by a novel mechanism featuring CO 2 bubble nucleation as a key step.

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“…Moreover, incorporation of POSS unit in backbone of the linear step-condensed polymer in definite structure was quite difficult as the polycondensation of POSS having multiple reactive sites of equivalent reactivity with di-functional monomers typically generates insoluble cross-linked products [15][16][17][18]. The problems caused by the multi-functionality of POSS could be readily eradicated by replacing POSS with double-decker silsesquioxane (DDSQ) having two definite polymerizable functional groups.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of Polysilsesquioxanes with Double-Decker Silsesquioxane Repeating Units

Hoque¹,

Kawakami²

2016

J. Sci. Res.

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Polysilsesquioxanes were synthesized with end functional double-decker silsesquioxanes (DDSQ) and the polymers were characterized with 1 H NMR, 29 Si NMR and size exclusion chromatography (SEC). Polysilsesquioxane containing iso-butyl end capped DDSQ showed better solubility compared to that of methyl end capped DDSQ. Thermal properties investigated with TGA showed that the polymers exhibited exceptionally high stabilities in the range of 470-530°C even in both nitrogen and air atmosphere. The average residual weights of the polymers at 760°C were around 80% in the nitrogen atmosphere.

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Polyimide and polyhedral oligomeric silsesquioxane nanocomposites for low-dielectric applications

Cited by 186 publications

References 20 publications

Organosoluble, thermally stable and low dielectric constant fluorinated polyimides containing 2,4,5-triphenylimidazole moiety in the main chains

Organosoluble, thermally stable and low dielectric constant fluorinated polyimides containing 2,4,5-triphenylimidazole moiety in the main chains

Controlling the Pore Structure of Polyimide Films Prepared by Exposure to High-Pressure CO<sub>2</sub> and UV Light

Synthesis of Polysilsesquioxanes with Double-Decker Silsesquioxane Repeating Units

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