Polyimide films tailored by UV irradiation: Surface evaluation and structure-properties relationship

Rusu, Radu‐Dan; Constantin, Catalin-Paul; Drobotă, Mioara; Grădinaru, Luiza Madalina; Butnaru, Maria; Pîslaru, Marius

doi:10.1016/j.polymdegradstab.2020.109182

Cited by 31 publications

(20 citation statements)

References 29 publications

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“…High energy ionizing radiation such as proton, 13 gammaray, [14][15][16][17][18][19][20] UV treatment, [21][22][23][24][25] and X-ray 15 has been utilized as an alternative approach for tailoring the structural and electrical conductivities of the lms. Usually, these approaches are temperature independent and in turn results in material with higher purity.…”

Section: Introductionmentioning

confidence: 99%

Consequences of gamma-ray irradiation on structural and electronic properties of PEDOT:PSS polymer in air and vacuum environments

et al. 2021

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Section: Introductionmentioning

confidence: 99%

Consequences of gamma-ray irradiation on structural and electronic properties of PEDOT:PSS polymer in air and vacuum environments

et al. 2021

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“…Similar to the APS CPI spectrum, the APS-OH CPI spectrum showed a C=O aromatic stretching peak a C-N-C peak indicating imidization at 1777 cm −1 , 1716 cm −1 , and 1380 cm −1 , respectively. It was found that the two imide reactions were completed [ 25 , 26 , 27 ].…”

Section: Resultsmentioning

confidence: 99%

Colorless and Transparent Polyimide Microporous Film with Excellent Physicochemical Property

et al. 2021

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4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA) as a dianhydride and bis(3-aminophenyl) sulfone (APS) and bis(3-amino-4-hydroxyphenyl) sulfone (APS-OH) as diamines were used to synthesize two types of poly(amic acid) (PAA). Varying amounts (0–5.0 wt%) of water-soluble poly(vinyl alcohol) (PVA) were mixed with PAA, and the resulting blend was heat-treated at different stages to obtain the colorless and transparent polyimide (CPI) blend films. The synthesized blended film completely removed water-soluble PVA in water. The possibility as a porous membrane according to the pore size varied according to the amount of PVA was investigated. The dispersibility and compatibility of CPI containing APS-OH monomer were higher than those of the APS monomer. This could be attributed to the hydrogen-bonding interactions between the CPI main chains and PVA. Scanning electron microscopy was conducted to characterize the material. The results revealed that the pore size of the CPI blend film increased as the PVA concentration increased. It was confirmed that uniform pores of μm-size were observed in CPI. The thermal stabilities, morphologies, optical properties, and solubilities of two CPIs obtained using APS and APS-OH monomers were investigated and their properties were compared with each other.

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“…[ 173 ] The effect of the UV irradiation treatment on surface wettability and thin‐film adhesion depends on various factors such as the intensity, wavelength, and exposure duration. [ 174 ] For instance, Rye et al. have investigated the effect of UV wavelength (UVA, UVB, and UVC) on the adhesion strength of printed copper films and found out that only UVC light (wavelength: 254 nm) is able to improve the surface wettability and copper film adhesion on polyimide film.…”

Section: Pre‐ Intermediate‐ and Postprinting Treatment For Mlmm Electronicsmentioning

confidence: 99%

“…[ 175 ] However, long UV irradiation duration (e.g., > 10 hours) should be avoided to prevent over‐roughening and unfavorable changes in the mechanical property of the substrates. [ 174 ] Interestingly, the UV irradiation treatment can be done with various irradiation sources, such as UVC lamp, intense pulsed light lamp, and a laser source. [ 174–176 ] Unlike other surface treatment methods, selective surface treatment can be made possible with a UV laser source to tailor different surface wettability on a substrate.…”

Section: Pre‐ Intermediate‐ and Postprinting Treatment For Mlmm Electronicsmentioning

confidence: 99%

3D Printing of Multilayered and Multimaterial Electronics: A Review

Goh

Zhang

Chong

et al. 2021

Adv Elect Materials

182

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3D printing, also known as additive manufacturing, is a manufacturing process in which the materials are deposited layer by layer in an additive manner. With the advancement in materials and manufacturing technology, 3D printing has found its applications in the field of electronics manufacturing. Initially, 3D printing is used for the fabrication of electronic components with single material designs such as resistors, inductors, circuits, antennas, strain gauges, etc. Recently, there are many works involving the use of 3D printing fabrication techniques for advanced electronic components and devices such as parallel plate capacitors, inductors, organic light‐emitting diodes, photovoltaics, transistors, displays, etc. which involve multilayer multimaterial printing. Despite these many works, there has been no review on the design and fabrication consideration for the 3D printing of multilayered and multimaterial (MLMM) electronics. As such, this review aims to summarize the current landscape of 3D printing of MLMM electronics and provide some insights on the design consideration, fabrication strategies, and challenges of 3D printing of MLMM electronics. In particular, the focus will be placed on discussing the interface conditions between different materials such as surface wettability, surface roughness, material compatibility, and the considerations for postprocessing treatments.

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Polyimide films tailored by UV irradiation: Surface evaluation and structure-properties relationship

Cited by 31 publications

References 29 publications

Consequences of gamma-ray irradiation on structural and electronic properties of PEDOT:PSS polymer in air and vacuum environments

Consequences of gamma-ray irradiation on structural and electronic properties of PEDOT:PSS polymer in air and vacuum environments

Colorless and Transparent Polyimide Microporous Film with Excellent Physicochemical Property

3D Printing of Multilayered and Multimaterial Electronics: A Review

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