Polyimide hollow glass microspheres composite films with low dielectric constant and excellent thermal performance

Abstract

Nowadays, polyimide (PI) with low dielectric constant is expected to be widely applied in microelectronics. For this reason, hollow glass microspheres (HGM) modified by silane coupling agent KH-550 (K-HGM), a series of HGM/PI and K-HGM/PI composite films with excellent thermal performance, hydrophobic and low dielectric constant were fabricated by in situ polymerization. The effect of HGM/K-HGM content on the properties of composite films was studied. The superior heat resistance of HGM can improve the thermal performance of composite films. Due to silane coupling agent KH-550, K-HGM exhibits a good interfacial compatibility with PI matrix and forms an interfacial adhesion region. With the HGM loading of 6%, comparing with pure PI films, the glass transition temperatures (T g) of composite films were dramatically increased by 32.3 C. Especially, the low dielectric constant of 2.21 and dielectric loss of 0.0059 at 1 MHz were obtained for the PI/K-HGM composite film with addition of 8 wt%. Thus, PI/K-HGM composite films show more excellent performance. The current work provides a promising solution for fabrication of PI with low dielectric constant and superior thermal performance that may be applied in microelectronics industry.

Modified hollow glass microsphere isocyanate-based polyimide foam composite with improved mechanical and thermal insulation properties

“…In addition, the absorption peaks at 1078 cm −1 , 798 cm −1 , and 466 cm −1 are the stretching vibration peak of Si-OH, the stretching vibration absorption peak of Si-O, and the bending vibration absorption peak of Si-O-Si, respectively. 21,23 These absorption peaks are consistent before and after HGM modification, indicating that the HGM surface modification does not change the original chemical structure. Another significant absorption peaks at 1598 cm −1 and 1348 cm −1 are ascribed to the bending vibration peak of N-H and stretching vibration peak of C-N.…”

“…Some researchers have used the silane coupling agent to modify the hollow glass microsphere, expandable graphite, and other inorganic filler, and then compound with polymer materials. [19][20][21][22] The results show that inorganic fillers modified with silane coupling agent modified have good interfacial compatibility with the polymer matrix. More importantly, the prepared composite materials present better mechanical properties and thermal stability than the pure polymer materials.…”

Epoxy resin/hollow glass microspheres composite materials with low dielectric constant and excellent mechanical performance

“…Compared with other methods, the addition of inorganic fillers is to be a preferable way because of their facile process, low cost, low added amount and high efficient. Up to now, many researches introduced the inorganic materials like phyllosilicates, mullites, silicon nanotubes, graphene oxide (GO), hollow glass microspheres (HGM), and so on to reduce polymer dielectric constant 10–17 . Ilango et al 18 reported low dielectric polybenzoxazine/porous mullites nanocomposite materials by template‐assisted and blending methods, and the introduction of porous mullites improved its thermal stability.…”

“…Based on these characteristics, HGM is a good component for manufacturing low dielectric materials. [26][27][28][29][30] Cao 16 modified HGM via KH550, and fabricated PI/HGM nanocomposite possessing excellent thermal performance and low dielectric constant. Vignali et al 31 reported novel nanocomposites based on poly (ε-caprolactone)/HGM via the introduction of (3-aminopropyl) triethoxysilane modified additive, and exhibited good compatibility.…”

“…Up to now, many researches introduced the inorganic materials like phyllosilicates, mullites, silicon nanotubes, graphene oxide (GO), hollow glass microspheres (HGM), and so on to reduce polymer dielectric constant. [10][11][12][13][14][15][16][17] Ilango et al 18 reported low dielectric polybenzoxazine/porous mullites nanocomposite materials by template-assisted and blending methods, and the introduction of porous mullites improved its thermal stability. Zhao 19 prepared nanocomposites by introducing graphene oxide into epoxy resin.…”