Polyimide nanostructures fabricated by nanoimprint lithography and its applications

Cui, Bo; Cortot, Yann; Veres, Teodor

doi:10.1016/j.mee.2006.01.014

Cited by 42 publications

(32 citation statements)

References 8 publications

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“…It also has a drawback of long processing time including heating and cooling processes. To overcome this, several types of low-temperature nanoimprint processes using polyimide precursors have been suggested as alternative processes [24][25][26][27][28]. In these processes, polyimide precursor resin in liquid state is nanoimprinted, and is then cured at 300-400 o C to induce a thermal imidization reaction.…”

Section: Introductionmentioning

confidence: 99%

Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process

Suzuki

Youn

Park

et al. 2014

J. Photopol. Sci. Technol.

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In this study, Cu/polyimide multilayer interconnections (dual-damascene) approach based on a UV-assisted thermal nanoimprint technique at every lithography process was demonstrated aiming at developing a low-cost fabrication process for high-density interconnections in polyimide. The dual-damascene process can be simplified by nanoimprint using a multi-tiered mold, and realize fine interconnections using a soluble polyimide block copolymer with a high formability and low shrinkage during a polyimide patterning process. Three-layered Cu/polyimide structures with a minimum wire-width of 5 µm were fabricated in the polyimide by performing subsequent Cu electroplating and chemical mechanical polishing (CMP). The feasibility of the process was thus verified. The electric resistances values of the fabricated three-layered interconnections measured by a four-terminal method showed linear increase as a function of the number of interconnection vias. Heat resistance test at 260 o C which corresponded to reflow soldering process was also evaluated; less than 1.2%-increasing ratio of electric resistance was obtained in the case of 3-cycle heating.

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Section: Introductionmentioning

confidence: 99%

Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process

Suzuki

Youn

Park

et al. 2014

J. Photopol. Sci. Technol.

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“…Aromatic polyimide, Pyralin 2525 (HD Microsystems PI2525), has been imprinting by three approaches; imprint as its uncured soft state and cure it afterwards; imprint another low Tg polymer, then form the pattern on polyimide surface by oxygen reactive ion etching; and direct imprint on polyimide surface at temperature higher than its Tg [9]. Since aromatic polyimides do not exhibit high molecular mobility even at temperatures higher than their Tg, the processing conditions for molding are extremely severe, or polyimide films are prepared by conversion of soluble polyamic acids, the precursors of polyimide [5].…”

Section: Introductionmentioning

confidence: 99%

Preparation of Nanopatterned Polyimide by Imprinting and Curing Phenylethynyl- terminated Imide Oligomer

Ogino

Ōhashi

Yoshida

et al. 2014

J. Photopol. Sci. Technol.

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Addition-type phenylethynyl-terminated imide oligomers were synthesized from 4,4'-diaminodiphenyl ether(ODA), 4-phenylethynylphthalic anhydride (PEPA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) or 4,4'-hexafluoroisopropylidene)-dianhydrid (6FDA), and preparation of nanopatterned polyimide was examined by imprinting the melted phenylethynyl-terminated imide oligomer and crosslinking the ethynyl groups. Crosslinked polyimide films were prepared by pressing the melted phenylethynyl-terminated imide oligomers and curing them under pressure at 370 ℃ afterward, and the properties of the polyimide films were studied for comparison. The crosslnked polyimide films had high glass transition temperature (Tg) above 320 ℃, and showed excellent tensile strength more than 100 MPa. Nanopatterned polyimide was prepared by imprinting the melted imide oligomer with a metal mold and curing it under pressure at 370 ℃ afterward. ZEONOR Ⓡ film could be imprinted using the imprinted and cured imide oligomer as sub-mold instead of the metal mold.

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“…However, PIs have a high T g (4300 1C), which limits the application of the microscale/nanoscale-patterned PIs as LC alignment layers in industry. [4][5][6] Three approaches using NIL to pattern PI films have been developed: 16 imprint at the uncured soft state and cure the film afterward; imprint another low T g polymer, then transfer the pattern into PI by reactive-ion etching; and direct imprint into PI at a temperature higher than its T g . The first approach is relatively simple and fast, but some residual solvent and water may cause outgassing when the PI is subjected to temperatures well above 200 1C for a prolonged period of time.…”

Section: Introductionmentioning

confidence: 99%

Morphology of nanoimprinted polyimide films fabricated via a controlled thermal history

Siqing

Takahara

2012

Polym J

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Fabricating nanopatterns on polyimide (PI) films directly by nanoimprint lithography (NIL) is difficult owing to the high glass transition temperature (T g ). In this study, a nanopatterned PI film was successfully obtained by nanoimprinting poly(amic acid) (PAA) film and curing it afterward. Differential scanning calorimetry, thermogravimetry and dynamic mechanical analysis were carried out to study the state of thermal molecular motion in PAA thick films that have the same content of residual solvent as the PAA thin films used in NIL. The thermal and dynamic mechanical behaviors of PI thick films were studied for comparison. An appropriate nanoimprinting process was proposed based on an understanding of the thermal and dynamic mechanical properties of PAA and PI films. Atomic force microscopy showed that the line pattern was transferred without distortion from the PAA film to the PI film, even though a larger shrinkage took place during the hard baking.

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Polyimide nanostructures fabricated by nanoimprint lithography and its applications

Cited by 42 publications

References 8 publications

Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process

Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process

Preparation of Nanopatterned Polyimide by Imprinting and Curing Phenylethynyl- terminated Imide Oligomer

Morphology of nanoimprinted polyimide films fabricated via a controlled thermal history

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