Polyimide–silica hybrid films made from polyamic acids containing phenolic hydroxyl groups

Huang, Yi; Qin, Jiaqiang; Gu, Yi

doi:10.1002/app.20458

Cited by 15 publications

(6 citation statements)

References 5 publications

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“…IR bands at 690 cm −1 and 823 cm −1 were assigned to the maleimide CCH bonds, the peak characteristic of the allyl double bonds was located at 916 cm −1 , the absorbance band at 1180 cm −1 corresponded to CNC succinmide, appearance of a broad OH band toward 3000–3800 cm −1 and the wide band at 3436 cm −1 was correspondent to the stretching vibration of COH meaning that the novolak hydroxyl groups were generated during the course of curing cycle . It can be seen that both of the peaks at 690 cm −1 and 823 cm −1 were found to decrease with reaction time, thus confirming the gradual disappearance of maleimide double bonds.…”

Section: Resultsmentioning

confidence: 97%

Properties and curing behavior of reactive blended allyl novolak with bismaleimide using dicumyl peroxide as a novel curing agent

Jiang

Wang

Farhan

et al. 2014

J of Applied Polymer Sci

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For reducing the cure temperature and improving the thermal stability and mechanical properties, a thermosetting resin system composed of novolak and bismaleimide (BMI) was developed by reactive blending and using dicumyl peroxide (DCP) as a novel curing agent. Novolak was allylated and reacted with BMI to produce bismaleimide allylated novolak (BAN), and the effect of DCP on flexural, impact and heat distortion temperature of cured resin were investigated. On the basis of improved mechanical and thermal properties at 0.5% DCP contents, the curing behavior of DCP/BAN resin system was evaluated by DSC analysis. Ene, Diels-Alder, homo-polymerization and alternating copolymerization which occurred in DCP/BAN resin system were further verified using FTIR at sequential cure conditions from 140 to 200 C. Kissinger and Ozawa-Flynn-wall methods were used to optimize the process and curing reactions of DCP/BAN resin system. The results showed that the addition of 0.5% DCP in BAN reduced the curing temperature and time of the modified resin. For evaluating process ability of the modified system, composite samples using polyvinyl acetyl fiber were molded and tested for flexural properties. The resulting samples showed better flexural properties when compared with the composite made with neat BAN. The modified 0.5% DCP/BAN resin system with good mechanical properties and manufacturability can be used for making bulk molding compounds and fiber reinforced composites required in various commercial and aerospace applications.

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Section: Resultsmentioning

confidence: 97%

Properties and curing behavior of reactive blended allyl novolak with bismaleimide using dicumyl peroxide as a novel curing agent

Jiang

Wang

Farhan

et al. 2014

J of Applied Polymer Sci

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“…Several efforts have been made to obtain PIs with good solubility while maintaining the excellent thermal and mechanical properties. Recently, PIs with hydroxyl groups have attracted much attention among material scientists [21][22][23][24][25][26][27][28][29][30] for their good performance. The introduction of reactive hydroxyl groups does not decrease the thermal stability of polymers significantly, while at the same time, dissolution and adhesion performance of PI were improved.…”

Section: Introductionmentioning

confidence: 99%

Preparation and Characterization of Novel Polyimides with Hydroxyl Groups

Fei

Zhao

et al. 2011

Journal of Macromolecular Science, Part B

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DMAC) in different mole ratios. The polyimide (PI) films were obtained through thermal imidazation reactions of the thin layers of the above-mentioned precursor solutions. Chemical structures of all PI films were demonstrated by FT-IR. Thermal stabilities and decomposition behaviors of the PI films were tested by DSC and thermogravimetric analysis (TGA). Thermal measurements indicate that the polymers have high thermal stability and produce high char yields. The properties of the PI films were further studied by ultraviolet-visible spectroscopy, water absorption, surface energy, and mechanical measurements. Thermal analysis showed glass transition temperatures between 205.9 • C and 276.7 • C. Decomposition temperatures were higher than 360.2 • C, with 10% weight losses in the range of 448.6 • C∼517.8 • C. The prepared PI films also exhibited good UV absorption, low water absorption (<2%), low surface energy (<44.28 mJ/m 2 ), and good mechanical properties.

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“…In previous studies, PI/silica hybrid materials were prepared by the sol–gel route and characterized in terms of their curing behaviour, morphology, and mechanical properties. It was established that the morphology of the PI/silica hybrid can be controlled by introducing silicic structure onto main and side chain of PI molecule,7–9 adding coupling agents (such as GOTMS),10, 11 and using PI with the hydroxyl and carboxyl groups 12–14. Above researches were concentrated on improving the interfacial interaction between organic and inorganic components to make silica inorganic particles disperse in PI matrix.…”

Section: Introductionmentioning

confidence: 99%

“…It was established that the morphology of the PI/silica hybrid can be controlled by introducing silicic structure onto main and side chain of PI molecule, [7][8][9] adding coupling agents (such as GOTMS), 10,11 and using PI with the hydroxyl and carboxyl groups. [12][13][14] Above researches were concentrated on improving the interfacial interaction between organic and inorganic components to make silica inorganic particles disperse in PI matrix. Furthermore, researchers also attend to control the morphology and gain higher properties of PI/silica hybrid.…”

Section: Introductionmentioning

confidence: 99%

Study on morphology control and how to affect mechanical properties of polyimide/silica hybrid films

Qin¹,

Li²,

Gu³

2010

J of Applied Polymer Sci

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A series of polyimide (PI)/silica hybrid films were prepared by sol-gel method, using hydrolyzed tetraethoxysilane and poly amic acid-imides (PAA-Is), which were different imidization degree controlled by chemical imidization method. The imidization degree was characterized by Fourier transform infrared spectra and their corresponding morphology was characterized by scanning electron microscopy. The results show that there are two kinds of silica particles and their formative morphology obeys the double phase separation mechanism. According to the increase of PAA-I imidization degree, amount of nano silica particles decreased and the diameter of macro silica particles increased in the hybrid films. Tensile testing, dynamic mechanical analysis, and thermal mechanical analysis results show that, according to the amount of nano silica particles increasing, the hybrids have the higher the mechanical properties, glass transition temperature (T g ), and thermal expansion coefficient. Through controlling PI/silica hybrid films microstructure, its mechanical properties can be controlled.

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Polyimide–silica hybrid films made from polyamic acids containing phenolic hydroxyl groups

Cited by 15 publications

References 5 publications

Properties and curing behavior of reactive blended allyl novolak with bismaleimide using dicumyl peroxide as a novel curing agent

Properties and curing behavior of reactive blended allyl novolak with bismaleimide using dicumyl peroxide as a novel curing agent

Preparation and Characterization of Novel Polyimides with Hydroxyl Groups

Study on morphology control and how to affect mechanical properties of polyimide/silica hybrid films

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