2019
DOI: 10.1016/j.apsusc.2019.04.027
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Polymer-assisted surface decoration for critical current enhancement in YBa2Cu3O7−x films

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Cited by 11 publications
(11 citation statements)
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“…In particular, they were observed only at the interface and never embedded in the film matrix. The presence of this feature did not produce any increase of strain or other defects, e.g., stacking faults, in its surroundings as, on the contrary, revealed in films where other NPs are at the substrate interface and strain or stacking faults are evident in the film grown around the NP. , …”
Section: Resultssupporting
confidence: 89%
“…In particular, they were observed only at the interface and never embedded in the film matrix. The presence of this feature did not produce any increase of strain or other defects, e.g., stacking faults, in its surroundings as, on the contrary, revealed in films where other NPs are at the substrate interface and strain or stacking faults are evident in the film grown around the NP. , …”
Section: Resultssupporting
confidence: 89%
“…In such a scenario, the Lorentz force splits between the vortices and the magnetic pinning sites which results in higher current density before the vortices start depinning from the defects. The metal organic decomposition method has also been employed for decoration of the substrate surface for improving the vortex pinning properties of YBCO thin films [166][167][168].…”
Section: Substrate Surface Modificationsmentioning
confidence: 99%
“…Stacking faults consist of an extra Cu-O chain inserted between two Ba-O planes along the YBCO c-axis, resulting in a local variation of the stoichiometry (Y 2 Ba 4 Cu 8 O 16 , Y248 or Y124). This defect, created during the film growth stage in order to accommodate the strain along the c-axis, is promoted in extremely severe strain conditions, as in CSD YBCO with APC nanoparticles, or in pristine YBCO films close to the substrate interface region [37]. The presence of stacking faults has been reported often in previous works on YBCO with APC doping systems and BYNTO [28,30,38].…”
Section: Structural Analysesmentioning
confidence: 84%