Polymers for microelectronics

Knapp, Brian; Kohl, Paul A.

doi:10.1002/app.41233

Cited by 7 publications

(2 citation statements)

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“…Polymers and polymer composites are widely used in the molding industry for their ease of processability and moldability. According to Prismark Partners LLC, $48 billion worth polymeric materials were consumed in electronics in 2013 . Moreover, the trend is projected to increase due to the advancement of technological progress in the aforementioned areas.…”

Section: Introductionmentioning

confidence: 99%

Electrical and morphological properties of microinjection molded polystyrene/multiwalled carbon nanotubes nanocomposites

2016

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Masterbatch dilution was utilized to prepare polystyrene/ carbon nanotubes (PS/CNT) nanocomposites for microinjection molding (lIM). The effect of processing parameters, such as injection velocity and melt temperature, on the microstructure and electrical conductivity of injection molded microparts was systematically investigated. The electrical conductivity of the microparts was measured in three perpendicular directions to determine anisotropy. Results showed that the measured conductivity is process-dependent and melt temperature is the main factor that affects the electrical conductivity of the resultant samples. Electrical conductivity increased with an incremental loading fraction of CNT, and the percolation threshold shifted to higher filler loading concentration which was ascribed to the very high shear rate in lIM. In addition, Raman analysis, SEM observations, and simulation results indicated that CNT is preferentially oriented along the flow direction arising from the high shearing effect induced by lIM. FIG. 6. SEM images of the cross section of the microparts: (a, c) show the skin layer of thick section in different magnifications while (b, d) show the core layer of thick section in different magnifications.

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Section: Introductionmentioning

confidence: 99%

Electrical and morphological properties of microinjection molded polystyrene/multiwalled carbon nanotubes nanocomposites

2016

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“…In microelectronics, insulating materials that can be used to generate high-density and high-speed integrated circuits for enhancing performance, are typically required to separate the conducting parts from each other and sustain the mechanical structures of chips. [1][2][3][4][5][6] Various types of porous materials including silica and zeolite type frameworks, [7,8] fluorinated carbons, [9][10][11] organic polymers, [12,13] etc., currently dominate the field of interlayer dielectrics in microelectronic chip devices; however, their relatively low dielectric constant, brittleness, thermal stability and large static power dissipation limit their practical applications. [7][8][9][10][11][12][13] The International Technology Roadmap for Semiconductors (ITRS) has suggested that desirable materials for promoting novel low k-dielectrics should have the capability of forming a crystalline structure, have a high elastic modulus (> 3 GPa), reduced pore size (< 5 nm), hydrophobicity and a high chemical and thermal stability.…”

Section: Introductionmentioning

confidence: 99%

Hydrophobic Metal−Organic Frameworks and Derived Composites for Microelectronics Applications

Thanasekaran

Liu

et al. 2021

Chemistry A European J

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The extraordinary characteristic features of metal−organic frameworks (MOFs) make them applicable for use in a variety of fields but their conductivity in microelectronics over a wide relative humidity (RH) range has not been extensively explored. To achieve good performance, MOFs must be stable in water, i. e., under humid conditions. However, the design of ultrastable hydrophobic MOFs with high conductivity for use in microelectronics as conducting and dielectric materials remains a challenge. In this Review, we discuss applications of an emerging class of hydrophobic MOFs with respect to their use as active sensor coatings, tunable low‐κ dielectrics and conductivity, which provide high‐level roadmap for stimulating the next steps toward the development and implementation of hydrophobic MOFs for use in microelectronic devices. Several methodologies including the incorporation of long alkyl chain and fluorinated linkers, doping of redox‐active 7,7,8,8‐tetracyanoquinodimethane (TCNQ), the use of guest molecules, and conducting polymers or carbon materials in the pores or surface of MOFs have been utilized to produce hydrophobic MOFs. The contact angle of a water droplet and a coating can be used to evaluate the degree of hydrophobicity of the surface of a MOF. These unique advantages enable hydrophobic MOFs to be used as a highly versatile platform for exploring multifunctional porous materials. Classic representative examples of each category are discussed in terms of coordination structures, types of hydrophobic design, and potential microelectronic applications. Lastly, a summary and outlook as concluding remarks in this field are presented. We envision that future research in the area of hydrophobic MOFs promise to provide important breakthroughs in microelectronics applications.

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Superior electromagnetic wave absorption performance of Fe3O4 modified graphene assembled porous carbon (mGAPC) based hybrid foam

Rao

Jena

Aepuru

et al. 2022

Materials Chemistry and Physics

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Polymers for microelectronics

Cited by 7 publications

References 0 publications

Electrical and morphological properties of microinjection molded polystyrene/multiwalled carbon nanotubes nanocomposites

Electrical and morphological properties of microinjection molded polystyrene/multiwalled carbon nanotubes nanocomposites

Hydrophobic Metal−Organic Frameworks and Derived Composites for Microelectronics Applications

Superior electromagnetic wave absorption performance of Fe3O4 modified graphene assembled porous carbon (mGAPC) based hybrid foam

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